US-20260130219-A1 - SEMICONDUCTOR MODULE

US20260130219A1US 20260130219 A1US20260130219 A1US 20260130219A1US-20260130219-A1

Abstract

In a semiconductor module, a resin housing is disposed on one surface of a cooler to provide a housing space together with the cooler. A substrate having a conductor is disposed in the housing space. A semiconductor element is joined to the conductor. A main terminal is inserted in the housing and joined to the conductor. A sealing body seals the substrate, the semiconductor element and a part of the main terminal in the housing space. A sealing material is interposed between the one surface of the cooler and a lower surface of the housing. A metal member having a fastening hole is integrated into the housing. The metal member protrudes from the lower surface of the housing and is in contact with the one surface of the cooler to provide a gap with a predetermined height between the lower surface and the one surface.

Inventors

Tomohiro Miyazaki
Keita HATASA
Takahiro Hirano

Assignees

DENSO CORPORATION

Dates

Publication Date: 20260507
Application Date: 20260102
Priority Date: 20230705

Claims (10)

1 . A semiconductor module comprising: a cooler having one surface; a resin housing having a frame body and being disposed on the one surface of the cooler to provide a housing space together with the cooler; a substrate disposed in the housing space on the one surface of the cooler, the substrate including an insulating base material and a conductor disposed on a surface of the insulating base material opposite to a surface facing the one surface of the cooler; a semiconductor element joined to the conductor; a main terminal inserted in the housing and joined to the conductor; a sealing body filled in the housing space and sealing the substrate, the semiconductor element and a part of the main terminal; a sealing material interposed between the one surface of the cooler and a lower surface of the housing; and a metal member formed with a fastening hole and integrated into the housing, wherein the metal member protrudes from the lower surface of the housing and is in contact with the one surface of the cooler to provide a gap with a predetermined height between the lower surface of the housing and the one surface of the cooler.
2 . The semiconductor module according to claim 1 , wherein the metal member is a collar.
3 . The semiconductor module according to claim 1 , wherein an amount of protrusion of the metal member from the lower surface of the housing is 0.1 mm or more and 0.3 mm or less.
4 . The semiconductor module according to claim 1 , wherein the substrate on which the semiconductor element is mounted is one of a plurality of substrates on which a plurality of semiconductor elements are mounted.
5 . The semiconductor module according to claim 4 , wherein the plurality of substrates are aligned in a predetermined direction, and the fastening hole is located at a position between adjacent substrates in the predetermined direction.
6 . The semiconductor module according to claim 4 , further comprising: a signal terminal electrically connected to at least one of the plurality of semiconductor elements through a bonding wire, wherein the sealing body is a gel that seals at least one of the plurality of semiconductor elements, at least one of the plurality of substrates, the part of the main terminal, and a part of the signal terminal, the housing includes at least one partition wall that connects to the frame body and partitions the housing space according to arrangements of the plurality of substrates, and the gel is filled in the housing space and has an upper surface at a position lower than an upper end of the at least one partition wall.
7 . The semiconductor module according to claim 6 , wherein the plurality of substrates include three substrates that provide an upper and lower arm circuit for one phase together with the semiconductor elements mounted thereon, the at least one partition wall is disposed between adjacent substrates, the at least one partition wall partitions the housing space into three spaces, and the three substrates are individually disposed in the three spaces.
8 . The semiconductor module according to claim 1 , wherein the housing has a protruding portion and a recessed portion, as portions with which the sealing body is in contact, and the recessed portion is disposed between the protruding portion and the one surface of the cooler.
9 . The semiconductor module according to claim 8 , wherein the substrate is disposed so that a part of the substrate overlaps with the protruding portion in a plan view viewed in a thickness direction of the substrate.
10 . The semiconductor module according to claim 8 , further comprising: a signal terminal electrically connected to the semiconductor element through a bonding wire, wherein the signal terminal is held on the housing, and the signal terminal has a connection portion to which the bonding wire is connected on an upper surface of the protruding portion.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS The present application is a continuation application of International Patent Application No. PCT/JP2024/020603 filed on Jun. 6, 2024, which designated the U.S. and claims the benefit of priority from Japanese Patent Application No. 2023-110772 filed on Jul. 5, 2023. The entire disclosures of all of the above applications are incorporated herein by reference. TECHNICAL FIELD The present disclosure herein relates to a semiconductor module. BACKGROUND WO 2019/102537 A1 discloses a semiconductor module. Contents of the description of WO 2019/102537 A1 are incorporated herein by reference as a description of technical elements in this description. SUMMARY According to an aspect of the present disclosure, a semiconductor module includes a cooler, a resin housing, a substrate, a semiconductor element, a main terminal, a sealing body, a sealing material, and a metal member. The cooler has one surface. The resin housing has a frame body and is disposed on the one surface of the cooler to provide a housing space together with the cooler. The substrate is disposed in the housing space on the one surface of the cooler. The substrate includes an insulating base material and a conductor disposed on a surface of the insulating base material opposite to a surface facing the one surface of the cooler. The semiconductor element is joined to the conductor. The main terminal is inserted in the housing and joined to the conductor. The sealing body is filled in the housing space and seals the substrate, the semiconductor element and a part of the main terminal. The sealing material may be interposed between the one surface of the cooler and a lower surface of the housing. The metal member may be formed with a fastening hole and integrated into the housing. The metal member may protrude from the lower surface of the housing and be in contact with the one surface of the cooler to provide a gap with a predetermined height between the lower surface of the housing and the one surface of the cooler. BRIEF DESCRIPTION OF DRAWINGS Features and advantages of the present disclosure will become more apparent from the following detailed description made with reference to the accompanying drawings. FIG. 1 is a diagram illustrating a circuit configuration of a power conversion device to which a semiconductor device according to a first embodiment is applied. FIG. 2 is a perspective view illustrating an example of a semiconductor module. FIG. 3 is a plan view of the semiconductor module. FIG. 4 is a cross-sectional view taken along a line IV-IV in FIG. 3. FIG. 5 is a plan view illustrating an example of the semiconductor device. FIG. 6 is a plan view illustrating a wiring pattern of a substrate. FIG. 7 is a cross-sectional view taken along a line VII-VII in FIG. 5. FIG. 8 is a cross-sectional view illustrating another example of the connection structure between a capacitor and the substrate. FIG. 9 is a cross-sectional view illustrating still another example of the connection structure between the capacitor and the substrate. FIG. 10 is a cross-sectional view illustrating still another example of the connection structure between the capacitor and the substrate. FIG. 11 is a circuit diagram illustrating a verification model. FIG. 12 is a diagram illustrating a verification result. FIG. 13 is a diagram illustrating a temperature distribution. FIG. 14 is a diagram illustrating disposition of a current path formed by a snubber circuit. FIG. 15 is a plan view illustrating a modification example. FIG. 16 is a plan view illustrating another modification example. FIG. 17 is a plan view illustrating still another modification example. FIG. 18 is a plan view illustrating a semiconductor element in a semiconductor device according to a second embodiment. FIG. 19 is a cross-sectional view taken along a line XIX-XIX in FIG. 18. FIG. 20 is a partial cross-sectional view of the semiconductor device and a semiconductor module. FIG. 21 is a plan view illustrating an example of a connection structure between a clip and the semiconductor element. FIG. 22 is a cross-sectional view taken along a line XXII-XXII in FIG. 21. FIG. 23 is a plan view illustrating another example of the connection structure between the clip and the semiconductor element. FIG. 24 is a perspective view illustrating the clip. FIG. 25 is a plan view illustrating another example of the clip. FIG. 26 is a plan view illustrating still another example of the clip. FIG. 27 is a cross-sectional view illustrating still another example of the clip. FIG. 28 is a plan view illustrating still another example of the clip. FIG. 29 is a plan view illustrating still another example of the connection structure between the clip and the semiconductor element. FIG. 30 is a cross-sectional view taken along a line XXX-XXX in FIG. 29. FIG. 31 is a plan view illustrating still another example of the clip. FIG. 32 is a plan view illustrating still another example of the clip