US-20260130250-A1 - ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

US20260130250A1US 20260130250 A1US20260130250 A1US 20260130250A1US-20260130250-A1

Abstract

In one example, an electronic device comprises a substrate comprising a conductive structure and a dielectric structure, the dielectric structure comprising an upper dielectric layer, an electronic component over a top side of the substrate and coupled with the conductive structure, an encapsulant over the top side of the substrate and adjacent a lateral side of the electronic component, and a shield over the top side of the electronic component and contacting a lateral side of the encapsulant and a first lateral side of the substrate. The conductive structure comprises a first tab structure at the first lateral side of the substrate, and wherein the first tab structure contacts the shield and extends above the upper dielectric layer. Other examples and related methods are also disclosed herein.

Inventors

Soo Hyun Kim
Won Myoung Ki
Dong Hoon HAN
Tae Kyeong HWANG

Assignees

Amkor Technology Singapore Holding Pte. Ltd.

Dates

Publication Date: 20260507
Application Date: 20251229

Claims (20)

1 . An electronic device, comprising: a substrate comprising a conductive structure and a dielectric structure, the dielectric structure comprising an upper dielectric layer, wherein a topmost side of the upper dielectric layer comprises a topmost side of the dielectric structure; an electronic component over a top side of the substrate and coupled with the conductive structure; an encapsulant over the top side of the substrate and adjacent a lateral side of the electronic component; and a shield over the top side of the electronic component and contacting a lateral side of the encapsulant and a first lateral side of the substrate; wherein the conductive structure comprises a first tab structure at the first lateral side of the substrate, wherein the first tab structure contacts the shield and is below the upper dielectric layer; and wherein the encapsulant comprises a skirt portion over a top side of the first tab structure and contacting a lateral side of the upper dielectric layer.
2 . The electronic device of claim 1 , wherein the topmost side of the first tab structure is exposed from the upper dielectric layer.
3 . The electronic device of claim 1 , wherein the encapsulant extends below the topmost side of the upper dielectric layer.
4 . The electronic device of claim 1 , wherein the skirt portion contacts a lateral side of the first tab structure.
5 . The electronic device of claim 1 , wherein: the first tab structure comprises a continuous structure extending across the first lateral side of the substrate.
6 . The electronic device of claim 1 , wherein: the first tab structure comprises a plurality of spaced apart tabs; and the dielectric structure is between a first one of the plurality of spaced apart tabs and a second one of the plurality of spaced apart tabs.
7 . The electronic device of claim 1 , wherein: a first portion of an upper side of the first tab structure is exposed from the upper dielectric layer; and the upper dielectric layer is over a second portion of the first tab structure.
8 . The electronic device of claim 1 , wherein: the first tab structure comprises a plurality of spaced apart tabs; and the skirt portion extends between a first one of the plurality of spaced apart tabs and a second one of the plurality of spaced apart tabs.
9 . An electronic device, comprising: a substrate comprising a dielectric structure and a conductive structure, wherein the dielectric structure comprises an upper dielectric layer at a topmost side of the substrate; an electronic component over the substrate and coupled with the conductive structure; an encapsulant over the substrate and covering a lateral side of the electronic component; and a shield covering a top side of the electronic component, a lateral side of the encapsulant, and a lateral side of the substrate; wherein the conductive structure comprises a tab structure at the lateral side of the substrate, and the tab structure is coupled with the shield; and wherein a topmost side of the tab structure is below a topmost side of the upper dielectric layer, and the encapsulant contacts the topmost side of the tab structure.
10 . The electronic device of claim 9 , wherein the topmost side of the tab structure is exposed from the upper dielectric layer.
11 . The electronic device of claim 9 , wherein the encapsulant extends below the topmost side of the upper dielectric layer.
12 . The electronic device of claim 9 , wherein the encapsulant contacts a lateral side of the tab structure.
13 . The electronic device of claim 9 , wherein: the tab structure comprises a first tab and a second tab spaced apart from the first tab; and the encapsulant extends between the first tab and the second tab.
14 . The electronic device of claim 9 , wherein: a first side of the tab structure contacts a first side of the shield; and a second side of the tab structure contacts a second side of the shield.
15 . An electronic device, comprising: a substrate comprising a dielectric structure and a conductive structure, wherein the dielectric structure comprises an upper dielectric layer at a topmost side of the substrate; an electronic component over the substrate and coupled with the conductive structure; an encapsulant over the substrate and covering a lateral side of the electronic component; a shield covering a top side of the electronic component, a lateral side of the encapsulant, and a lateral side of the substrate; wherein the conductive structure comprises a tab structure at the lateral side of the substrate, and the tab structure is coupled with the shield; wherein a top side of the tab structure extends above a topmost side of the upper dielectric layer; and wherein the tab structure comprises a tab via at a lateral side of the conductive structure, and the tab via extends below the topmost side of the upper dielectric layer.
16 . The electronic device of claim 15 , wherein the upper dielectric layer extends between the tab via and the shield.
17 . The electronic device of claim 15 , wherein the tab via contacts a lateral side of the shield.
18 . The electronic device of claim 15 , wherein the tab structure comprises: an upper tab extending above the topmost side of the upper dielectric layer; and a lower tab extending below a bottommost side of the upper dielectric layer; wherein the tab via extends between the upper tab and the lower tab.
19 . The electronic device of claim 18 , wherein the upper tab and the lower tab contact a lateral side of the shield.
20 . The electronic device of claim 18 , wherein a first portion of the upper tab extends laterally over the topmost side of the upper dielectric layer, and a first portion of the lower tab extends laterally below a bottommost side of the upper dielectric layer.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS The present application is a continuation of U.S. application Ser. No. 17/976,094 filed Oct. 28, 2022 (pending). Said application Ser. No. 17/976,094 and Pub. No. US 2024/0145369 are hereby incorporated herein by reference in their entireties. TECHNICAL FIELD The present disclosure relates, in general, to electronic devices, and more particularly, to electronic devices and methods for manufacturing electronic devices. BACKGROUND Prior electronic packages and methods for forming electronic packages are inadequate, resulting in, for example, excess cost, decreased reliability, relatively low performance, or package sizes that are too large. Further limitations and disadvantages of conventional and traditional approaches will become apparent to one of skill in the art, through comparison of such approaches with the present disclosure and reference to the drawings. BRIEF DESCRIPTION OF THE DRAWINGS FIGS. 1A and 1B show cross-sectional views of an example electronic device. FIG. 1C shows a plan view an example electronic device. FIGS. 2A, 2B, 2C, 2D, and 2E show cross-sectional views, taken along the line A-A′ in FIG. 1C, of an example method for manufacturing an example electronic device. FIG. 2A-1, 2B-1, 2C-1, 2D-1, and 2E-1 show cross-sectional views, taken along the line B-B′ in FIG. 1C, of an example method for manufacturing an example electronic device. FIGS. 3A and 3A-1 show a left-side view of the exemplary electronic device shown in FIG. 2A. FIGS. 3B and 3B-1 show a right-side view of the exemplary electronic device shown in FIG. 2A. FIGS. 3C and 3D show a left-side view and a right-side view, respectively of the exemplary electronic device shown in FIG. 2A-1. FIGS. 4A and 4A-1 show a left-side view of the exemplary electronic device shown in FIG. 2C. FIGS. 4B and 4B-1 show a right-side view of the exemplary electronic device shown in FIG. 2C. FIGS. 4C and 4D show a left-side view and a right-side view, respectively, of the exemplary electronic device shown in FIG. 2C-1. The following discussion provides various examples of electronic devices and methods of manufacturing electronic devices. Such examples are non-limiting, and the scope of the appended claims should not be limited to the particular examples disclosed. In the following discussion, the terms “example” and “e.g.,” are non-limiting. The figures illustrate the general manner of construction, and descriptions and details of well-known features and techniques may be omitted to avoid unnecessarily obscuring the present disclosure. In addition, elements in the drawing figures are not necessarily drawn to scale. For example, the dimensions of some of the elements in the figures may be exaggerated relative to other elements to help improve understanding of the examples discussed in the present disclosure. Crosshatching lines may be used throughout the figures to denote different parts but not necessarily to denote the same or different materials. Throughout the present disclosure, like reference numbers denote like elements. Accordingly, elements with like element numbering may be shown in the figures but may not be necessarily repeated herein for the sake of clarity. The term “or” means any one or more of the items in the list joined by “or.” As an example, “x or y” means any element of the three-element set {(x), (y), (x, y)}. As another example, “x, y, or z” means any element of the seven-element set {(x), (y), (z), (x, y), (x, z), (y, z), (x, y, z)}. The terms “comprises,” “comprising,” “includes,” and “including” are “open ended” terms and specify the presence of stated features, but do not preclude the presence or addition of one or more other features. The terms “first,” “second,” etc. may be used herein to describe various elements, and these elements should not be limited by these terms. These terms are only used to distinguish one element from another. Thus, for example, a first element discussed in this disclosure could be termed a second element without departing from the teachings of the present disclosure. Unless specified otherwise, the term “coupled” may be used to describe two elements directly contacting each other or to describe two elements indirectly coupled by one or more other elements. For example, if element A is coupled to element B, then element A can be directly contacting element B or indirectly coupled to element B by an intervening element C. As used herein, the term coupled can refer to an electrical coupling or a mechanical coupling. Similarly, the terms “over” or “on” may be used to describe two elements directly contacting each other or describe two elements indirectly coupled by one or more other elements. DESCRIPTION In one example, an electronic device comprises a substrate comprising a conductive structure and a dielectric structure, the dielectric structure comprising an upper dielectric layer, an electronic component over a top side of the substrate and coupled with th