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US-20260130254-A1 - SMART IC SUBSTRATE, SMART IC MODULE, AND IC CARD COMPRISING SAME

US20260130254A1US 20260130254 A1US20260130254 A1US 20260130254A1US-20260130254-A1

Abstract

A smart IC substrate according to an embodiment includes a substrate including a first surface and a second surface opposite to the first surface; a bonding layer disposed on the first surface; a metal layer disposed on the bonding layer; and a plating layer disposed on one surface of the metal layer, and wherein the metal layer includes an aluminum (Al)-copper (Cu) alloy or an aluminum (Al)-copper (Cu)-A alloy.

Inventors

  • Min Sung Jo
  • Myoung Lae ROH
  • Tae Jin Lee
  • Seok Su SOHN
  • Hyun Chung
  • Tae Jin JANG

Assignees

  • LG INNOTEK CO., LTD.
  • KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION

Dates

Publication Date
20260507
Application Date
20231006
Priority Date
20221021

Claims (16)

  1. 1 - 10 . (canceled)
  2. 11 . A smart IC substrate comprising: a substrate; a bonding layer disposed on the substrate; a metal layer disposed on the bonding layer and including an aluminum alloy; and a plating layer disposed on the metal layer, wherein the substrate and the bonding layer include a through hole, wherein an upper surface and a side surface of the metal layer are covered with the plating layer, and wherein a lower surface of the metal layer in a region overlapping the through hole in a vertical direction is exposed and provided in the through hole.
  3. 12 . The smart IC substrate of claim 11 , wherein the aluminum alloy includes aluminum having a content of 70 at % to 95 at % and copper having a content of 5 at % to 30 at %.
  4. 13 . The smart IC substrate of claim 11 , wherein the aluminum alloy includes aluminum, copper, and an additional metal, and wherein the additional metal includes at least one metal among nickel (Ni), titanium (Ti), zinc (Zn), tin (Sn), chromium (Cr), molybdenum (Mo), and manganese (Mn).
  5. 14 . The smart IC substrate of claim 13 , wherein the aluminum is contained in a content of 70 at % to 90 at %, wherein the copper is contained in a content of 5 at % to 25 at %, and wherein the additional metal is contained in a content of 0.1 at % to 10 at %.
  6. 15 . A smart IC module comprising: a substrate; a bonding layer disposed on the substrate; a metal layer disposed on the bonding layer and including an aluminum alloy; a plating layer disposed on the metal layer; a chip disposed under the substrate; and a wire electrically connecting the chip and the metal layer, wherein the substrate and the bonding layer include a through hole, wherein an upper surface and a side surface of the metal layer are covered with the plating layer, and wherein the wire is in direct contact with a lower surface of the metal layer in a region overlapping the through hole in a vertical direction.
  7. 16 . The smart IC module of claim 15 , comprising: a molding layer for molding the chip, wherein the molding layer includes a portion disposed within the through hole and in direct contact with a lower surface of the metal layer.
  8. 17 . A smart IC substrate comprising: a substrate; a first bonding layer disposed on the substrate; a second bonding layer disposed under the substrate; a first metal layer disposed on the first bonding layer; a second metal layer disposed under the second bonding layer; and a first plating layer disposed on the first metal layer, wherein the substrate and the first bonding layer include a through hole, wherein an upper surface and a side surface of the first metal layer are covered with the plating layer, wherein a lower surface of the first metal layer in a region overlapping the through hole in a vertical direction is exposed and provided within the through hole, and wherein the first metal layer includes an aluminum alloy.
  9. 18 . The smart IC substrate of claim 17 , wherein the aluminum alloy includes aluminum having a content of 70 at % to 95 at % and copper having a content of 5 at % to 30 at %.
  10. 19 . The smart IC substrate of claim 17 , wherein the aluminum alloy includes aluminum, copper, and an additional metal, wherein the additional metal includes at least one metal among nickel (Ni), titanium (Ti), zinc (Zn), tin (Sn), chromium (Cr), molybdenum (Mo), and manganese (Mn), wherein the aluminum is contained in a content of 70 at % to 90 at %, wherein the copper is contained in a content of 5 at % to 25 at %, and wherein the additional metal is contained in a content of 0.1 at % to 10 at %.
  11. 20 . The smart IC substrate of claim 17 , wherein the first metal layer and the second metal layer include different metal materials.
  12. 21 . The smart IC substrate of claim 20 , comprising: a second plating layer disposed under the second metal layer.
  13. 22 . The smart IC substrate of claim 17 , wherein the first metal layer and the second metal layer include a same metal material.
  14. 23 . The smart IC substrate of claim 17 , comprising: a chip disposed under the substrate; and a wire electrically connecting the chip and the first metal layer, wherein the wire is in direct contact with the lower surface of the first metal layer in the region overlapping the through hole in the vertical direction.
  15. 24 . The smart IC substrate of claim 23 , comprising: a molding layer for molding the chip, and wherein the molding layer includes a portion disposed within the through hole and in direct contact with the lower surface of the first metal layer.
  16. 25 . The smart IC substrate of claim 24 , wherein the first metal layer and the second metal layer include a same metal material, wherein the wire includes a first wire in direct contact with the lower surface of the first metal layer, and a second wire in direct contact with a lower surface of the second metal layer, and wherein the molding layer includes a portion in direct contact with the side surface and the lower surface of the second metal layer.

Description

TECHNICAL FIELD An embodiment relates to a smart IC substrate, a smart IC module, and an IC card comprising same. BACKGROUND ART An IC card is a plastic card with an integrated circuit chip embedded therein. The integrated circuit chip stores and processes information. The information is transmitted to a reader in a form of an electric signal. The IC card is manufactured by inserting a smart IC module into a main body of the card. The smart IC module is classified into a single type or a dual type depending on an arrangement of a metal layer. The single type has a metal layer and a plating layer disposed only on one surface of a substrate. The dual type has a metal layer and a plating layer disposed on both surfaces of the substrate. In addition, the smart IC module is classified into a contact, contactless, hybrid, and combi card depending on an usage method of the card. The contact card transmits and receives information by physical contact. The contactless card transmits and receives information without physical contact. The hybrid card and the combi card include both the contact and contactless functions. Accordingly, the smart IC module includes a contact surface and a bonding surface. The contact surface comes into contact with an external device. A chip is disposed on the bonding surface. The bonding surface is inserted inside of the card body. The chip disposed on the bonding surface and the metal layer disposed on the contact surface are electrically connected by wire bonding. Accordingly, the smart IC module includes a plurality of holes. The chip and the metal layer are wire bonded through the holes. A plating layer for wire bonding can be disposed on the metal layer. A manufacturing process of the smart IC module can be increased by the plating layer. In addition, the plating layer includes gold (Au). Accordingly, the process cost can be increased. Therefore, a new structure of a smart IC substrate, a smart IC module, and an IC card that can solve the above problems is required. DISCLOSURE Technical Problem An embodiment provides a smart IC substrate with improved reliability. Technical Solution A smart IC substrate according to an embodiment includes a substrate including a first surface and a second surface opposite to the first surface; a bonding layer disposed on the first surface; a metal layer disposed on the bonding layer; and a plating layer disposed on one surface of the metal layer, and wherein the metal layer includes an aluminum (Al)-copper (Cu) alloy or an aluminum (Al)-copper (Cu)-A alloy. Advantageous Effects A smart IC substrate according to an embodiment includes a metal layer. The metal layer includes an alloy. The metal layer includes a plurality of conductive patterns. The alloy may be a binary alloy or a ternary or higher alloy. Since the metal layer is formed of the alloy, a bonding property and a rigidity of the metal layer are improved. Accordingly, a wire can be directly bonded to the metal layer. Accordingly, a separate plating layer for connecting the chip and the metal layer can be omitted. Accordingly, the process efficiency is improved. In addition, the plurality of wires are bonded to a same metal layer. Accordingly, the bonding property of the wires can be uniform. Accordingly, the reliability of the smart IC module is improved. In addition, since the metal layer is formed of the alloy, corrosion resistance and electrical conductivity of the metal layer are improved. Accordingly, a signal between the chip and the conductive pattern can be easily transferred. In addition, a bonding region of the metal layer can be prevented from being oxidized during a process. DESCRIPTION OF DRAWINGS FIG. 1 is a top view of a first surface of a smart IC substrate according to a first embodiment. FIG. 2 is a top view of a second surface of a smart IC substrate according to a first embodiment. FIG. 3 is a cross-sectional view taken along region A-A′ of FIG. 2. FIG. 4 is a top view of a second surface of a smart IC module according to a first embodiment. FIG. 5 is a cross-sectional view taken along region B-B′ of FIG. 4. FIG. 6 is a top view of a first surface of a smart IC substrate according to a second embodiment. FIG. 7 is a top view of a second surface of a smart IC substrate according to a second embodiment. FIG. 8 is a cross-sectional view taken along region C-C′ of FIG. 7. FIG. 9 and FIG. 10 are cross-sectional views taken along region D-D′ of FIG. 7. FIG. 11 is a top view of a second surface of a smart IC module according to a second embodiment. FIG. 12 is a cross-sectional view taken along region E-E′ of FIG. 11. FIG. 13 is a cross-sectional view taken along region of FIG. 11. FIG. 14 is an exploded perspective view of a smart IC card according to an embodiment. FIG. 15 is a drawing for explaining a combination of a smart IC module according to an embodiment. MODES OF THE INVENTION Hereinafter, embodiments of the present disclosure will be described in detail with reference