US-20260130265-A1 - SUBSTRATE PROCESSING SYSTEM, INTERFACE APPARATUS, AND SUBSTRATE PROCESSING METHOD

Abstract

A substrate processing system includes: a batch-type processing part that collectively processes a lot including substrates arranged at a first pitch; a single-substrate-type processing part that processes the substrates of the lot one by one; and an interface part that delivers the substrates between the batch-type processing part and the single-substrate-type processing part. The batch-type processing part includes a processing bath that stores a processing solution having a lump shape or a mist shape, a first holder that holds the substrates arranged at the first pitch, and a second holder that receives the substrates arranged at a second pitch from the first holder in the processing solution. The interface part includes a transfer part that transfers the substrates held separately by the first and second holders in the processing solution, from the batch-type processing part to the single-substrate-type processing part.

Inventors

• Kouzou Kanagawa
• Kotaro Tsurusaki
• Keiji Onzuka
• Yoshihiro Kai

Assignees

• TOKYO ELECTRON LIMITED

Dates

Publication Date

20260507

Application Date

20251230

Priority Date

20191010

Claims (20)

1. 1 - 20 . (canceled)
2. 21 . A substrate processing system comprising: a batch-type processing part configured to collectively process a plurality of substrates; a loading part into which a first cassette that accommodates the plurality of substrates is loaded; a single-substrate-type processing part configured to process the plurality of substrates one by one; an interface part configured to deliver the plurality of substrates between the batch-type processing part and the single-substrate-type processing part; and an unloading part from which a second cassette that accommodates the plurality of substrates is unloaded, wherein the batch-type processing part includes a processing bath that stores a processing solution having a lump shape or a mist shape which is larger than a size of the plurality of substrates, wherein the loading part and the batch-type processing part are disposed in parallel with respect to the unloading part and the single-substrate-type processing part, wherein the interface part is adjacent to the batch-type processing part and the single-substrate-type processing part, wherein the interface part includes: a first transfer region including a first transfer device; a first transition device being adjacent to the batch-type processing part and configured to hold the plurality of substrates in a horizontal posture; and a second transition device being adjacent to the single-substrate-type processing part and configured to hold the substrate, which is transferred from the first transfer device, in the horizontal posture, wherein the first transfer device is configured to transfer at least one substrate between the first transition device and the second transition device, and wherein the first transition device, the first transfer region, and the second transition device are arranged in a row in this order.
3. 22 . The substrate processing system of claim 21 , wherein the batch-type processing part includes a rot formation part configured to form a rot which includes the plurality of substrates, wherein the rot formation part includes a first holder configured to hold the plurality of substrates arranged at a first pitch and a second holder configured to receive the plurality of substrates arranged at a second pitch, which is N times of the first pitch (N is a natural number equal to or greater than 2), from the first holder in the processing solution, and wherein the interface part includes a transfer part configured to transfer the plurality of substrates, which are held separately by the first holder and the second holder in the processing solution, from the batch-type processing part to the single-substrate-type processing part.
4. 23 . The substrate processing system of claim 22 , wherein the batch-type processing part includes a second transfer region having a rectangular shape in a plan view, and a second transfer device configured to move and rotate while holding the lot in the second transfer region.
5. 24 . The substrate processing system of claim 21 , wherein the batch-type processing part includes a second transfer region having a rectangular shape in a plan view, wherein the processing bath is arranged near a long side of the second transfer region, wherein the interface part includes a transfer robot configured to lift up the plurality of substrates from the processing bath to transfer the plurality of substrates to the first transition device, wherein the transfer robot, the first transition device, the first transfer region, and the second transition device are arranged in a row in this order.
6. 25 . The substrate processing system of claim 22 , wherein the processing bath is configured to store pure water in which the lot is immersed.
7. 26 . The substrate processing system of claim 22 , wherein the batch-type processing part includes a chemical solution bath that stores a dilute hydrofluoric acid in which the lot is immersed.
8. 27 . The substrate processing system of claim 22 , wherein the batch-type processing part includes a chemical solution bath that stores a phosphoric acid aqueous solution in which the lot is immersed.
9. 28 . The substrate processing system of claim 22 , wherein the batch-type processing part includes a chemical solution bath that stores a mixed solution of ammonia, hydrogen peroxide and water, in which the lot is immersed.
10. 29 . The substrate processing system of claim 22 , wherein the batch-type processing part includes a chemical solution bath that stores a mixed solution of sulfuric acid, hydrogen peroxide, and water, in which the lot is immersed.
11. 30 . The substrate processing system of claim 21 , wherein the single-substrate-type processing part includes a solution processing apparatus configured to process the plurality of substrates one by one with a solution.
12. 31 . The substrate processing system of claim 21 , wherein the single-substrate-type processing part includes a drying apparatus configured to dry the plurality of substrates one by one with a supercritical fluid.
13. 32 . An interface apparatus used in a substrate processing system including a loading part into which a first cassette that accommodates a plurality of substrates is loaded, a batch-type processing part configured to collectively process the plurality of substrates and including a processing bath that stores a processing solution having a lump shape or a mist shape which is larger than a size of the plurality of substrates, a single-substrate-type processing part configured to process the plurality of substrates one by one, and an unloading part from which a second cassette that accommodates the plurality of substrates is unloaded, the interface apparatus comprising: a first transfer region including a first transfer device; a first transition device being adjacent to the batch-type processing part and configured to hold the plurality of substrates in a horizontal posture; and a second transition device being adjacent to the single-substrate-type processing part and configured to hold the substrate, which is transferred from the first transfer device, in the horizontal posture, wherein the first transfer device is configured to transfer at least one substrate between the first transition device and the second transition device, wherein the first transition device, the first transfer region, and the second transition device are arranged in a row in this order, wherein the interface apparatus is adjacent to the batch-type processing part and the single-substrate-type processing part and is configured to deliver the plurality of substrates between the batch-type processing part and the single-substrate-type processing part, and wherein the loading part and the batch-type processing part are disposed in parallel with respect to the unloading part and the single-substrate-type processing part.
14. 33 . The interface apparatus of claim 32 , wherein the batch-type processing part includes a rot formation part configured to form a rot which includes the plurality of substrates, wherein the rot formation part includes a first holder configured to hold the plurality of substrates arranged at a first pitch and a second holder configured to receive the plurality of substrates arranged at a second pitch, which is N times of the first pitch (N is a natural number equal to or greater than 2), from the first holder in the processing solution, and wherein the interface apparatus includes a transfer part configured to transfer the plurality of substrates, which are held separately by the first holder and the second holder in the processing solution, from the batch-type processing part to the single-substrate-type processing part.
15. 34 . The interface apparatus of claim 33 , wherein the batch-type processing part includes a second transfer region having a rectangular shape in a plan view, and a second transfer device configured to move and rotate while holding the lot the plurality of substrates, in the second transfer region.
16. 35 . The interface apparatus of claim 32 , wherein the batch-type processing part includes a second transfer region having a rectangular shape in a plan view, wherein the processing bath is arranged near a long side of the second transfer region, wherein the interface apparatus includes a transfer robot configured to lift up the plurality of substrates from the processing bath to transfer the plurality of substrates to the first transition device, wherein the transfer robot, the first transition device, the first transfer region, and the second transition device are arranged in a row in this order.
17. 36 . A substrate processing method using a substrate processing system including a loading part, a batch-type processing part, an interface part, a single-substrate-type processing part, and an unloading part, the substrate processing method comprising: loading a first cassette that accommodates a plurality of substrates into the loading part; transferring the plurality of substrates from the loading part to the batch-type processing part; collectively processing the plurality of substrates in the batch-type processing part; delivering the plurality of substrates from the batch-type processing part to the single-substrate-type processing part using the interface part; processing the plurality of substrates one by one in the single-substrate-type processing part; transferring the plurality of substrates from the single-substrate-type processing part to the unloading part; and unloading from a second cassette that accommodates the plurality of substrates, wherein the batch-type processing part includes a processing bath that stores a processing solution having a lump shape or a mist shape which is larger than a size of the plurality of substrates, wherein the loading part and the batch-type processing part are disposed in parallel with respect to the unloading part and the single-substrate-type processing part, wherein the interface part is adjacent to the batch-type processing part and the single-substrate-type processing part, wherein the interface part includes: a first transfer region including a first transfer device; a first transition device being adjacent to the batch-type processing part and configured to hold the plurality of substrates in a horizontal posture; and a second transition device being adjacent to the single-substrate-type processing part and configured to hold the substrate, which is transferred from the first transfer device, in the horizontal posture, wherein the first transfer device is configured to transfer at least one substrate between the first transition device and the second transition device, and wherein the first transition device, the first transfer region, and the second transition device are arranged in a row in this order.
18. 37 . The substrate processing method of claim 36 , wherein the collectively processing the plurality of substrates includes: holding the plurality of substrates arranged at a first pitch using a first holder installed in the batch-type processing part; and receiving the plurality of substrates arranged at a second pitch, which is N times of the first pitch (N is a natural number equal to or greater than 2), from the first holder in the processing solution using a second holder installed in the batch-type processing part, and wherein the delivering the plurality of substrates includes transferring the plurality of substrates, which are held separately by the first holder and the second holder in the processing solution, from the batch-type processing part to the single-substrate-type processing part using a transfer part installed in the interface part.
19. 38 . The substrate processing method of claim 37 , wherein the batch-type processing part includes a second transfer region having a rectangular shape in a plan view, and a second transfer device, wherein the collectively processing the plurality of substrates includes moving and rotating while holding a lot, which includes the plurality of substrates, in the second transfer region using the second transfer device.
20. 39 . The substrate processing method of claim 36 , wherein the batch-type processing part includes a second transfer region having a rectangular shape in a plan view, wherein the processing bath is arranged near a long side of the second transfer region, wherein the delivering the plurality of substrates includes lifting up the plurality of substrates from the processing bath to transfer the plurality of substrates to the first transition device using a transfer robot installed in the interface part, wherein the transfer robot, the first transition device, the first transfer region, and the second transition device are arranged in a row in this order.

Description

CROSS-REFERENCE TO RELATED APPLICATION This application is based upon and claims the benefit of priority from Japanese Patent Application No. 2019-187084, filed on Oct. 10, 2019, the entire contents of which are incorporated herein by reference. TECHNICAL FIELD The present disclosure relates to a substrate processing system and a substrate processing method. BACKGROUND The drying apparatus disclosed in Patent Document 1 includes a buffer bath, a transfer part, and a rotary drying part. The buffer bath holds a semiconductor wafer, which has been washed with water while immersed. Plural sheets of semiconductor wafers are washed with water in a state of being placed on one holding stage, and are held in the water inside the buffer bath in the state of being placed on the holding stage. The transfer part picks up and transfers the semiconductor wafers one by one from the buffer bath. The rotary drying part supports one sheet of semiconductor wafer transferred by the transfer part such that the main surface thereof is kept horizontal and rotates the semiconductor wafer at a high speed to remove water. PRIOR ART DOCUMENT Patent Document Patent Document 1: Japanese Laid-Open Patent Publication No. H09-162157 SUMMARY According to one embodiment of the present disclosure, there is provided a substrate processing system including: a batch-type processing part configured to collectively process a lot including a plurality of substrates arranged at a first pitch; a single-substrate-type processing part configured to process the plurality of substrates of the lot one by one; and an interface part configured to deliver the plurality of substrates between the batch-type processing part and the single-substrate-type processing part, wherein the batch-type processing part includes a processing bath that stores a processing solution having a lump shape or a mist shape, a first holder configured to hold the plurality of substrates arranged at the first pitch, and a second holder configured to receive the plurality of substrates arranged at a second pitch, which is N times of the first pitch (N is a natural number of 2 or more), from the first holder in the processing solution, and wherein the interface part includes a transfer part configured to transfer the plurality of substrates, which are held separately by the first holder and the second holder in the processing solution, from the batch-type processing part to the single-substrate-type processing part. BRIEF DESCRIPTION OF DRAWINGS The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the present disclosure, and together with the general description given above and the detailed description of the embodiments given below, serve to explain the principles of the present disclosure. FIG. 1 is a plan view of a substrate processing system according to an embodiment. FIG. 2 is a flowchart illustrating a substrate processing method according to an embodiment. FIG. 3 is a plan view illustrating an example of a lot formation part in FIG. 1. FIG. 4A is a side view illustrating an example of an operation of the lot formation part of FIG. 3. FIG. 4B is a side view illustrating an example of the operation of the lot formation part, which follows FIG. 4A. FIG. 4C is a side view illustrating an example of the operation of the lot formation part, which follows FIG. 4B. FIG. 5 is a plan view illustrating an example of a lot release part in FIG. 1. FIG. 6A is a cross-sectional view illustrating an example of operation of the lot release part of FIG. 5. FIG. 6B is a cross-sectional view illustrating an example of an operation of the lot formation part, which follows FIG. 6A. FIG. 6C is a cross-sectional view illustrating an example of the operation of the lot formation part, which follows FIG. 6B. FIG. 7 is a side view illustrating an example of a transfer part of an interface part in FIG. 1. FIG. 8 is a side view illustrating another example of the transfer part. FIG. 9 is a perspective view illustrating an example of a drying apparatus in FIG. 1. FIG. 10 is a plan view illustrating a substrate processing system of a first modification. FIG. 11 is a plan view illustrating a substrate processing system of a second modification. DETAILED DESCRIPTION Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. In addition, in each drawing, the same or corresponding components will be denoted by the same reference numerals, and a description thereof may be omitted. In the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of the present disclosure. However, it will be apparent to one of ordinary skill in the art that the present disclosure may be practiced without these specific details. In other instances, well-known methods, procedures, systems, and components have not been described in detail so as not to unnecessarily