US-20260130266-A1 - PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

Abstract

A package structure is provided. The package structure includes a device die bonded to a package substrate via a plurality of connectors. The package structure includes a dummy die bonded to the package substrate via a plurality of dummy connectors and disposed adjacent to the device die. The dummy die includes a base portion, an upper portion bonded to the base portion, and an edge molding material formed over the base portion and surrounding the upper portion. The package structure also includes a package molding material over the package substrate and around the dummy die and the device die. The Young's modulus of the edge molding material is less than the Young's modulus of the package molding material.

Inventors

• Hsin-Yu Chen
• Yu-Hsiang Hu
• Chien-Sheng Chen
• Chien-Hsun Lee
• Kathy Wei Yan

Assignees

• TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Dates

Publication Date

20260507

Application Date

20241107

Claims (20)

1. 1 . A package structure, comprising: a device die bonded to a package substrate via a plurality of connectors; a dummy die bonded to the package substrate via a plurality of dummy connectors and disposed adjacent to the device die, wherein the dummy die comprises: a base portion; an upper portion bonded to the base portion; and an edge molding material formed over the base portion and surrounding the upper portion; and a package molding material over the package substrate and around the dummy die and the device die, wherein a Young's modulus of the edge molding material is less than a Young's modulus of the package molding material.
2. 2 . The package structure as claimed in claim 1 , wherein the dummy die is disposed at a corner of the package molding material.
3. 3 . The package structure as claimed in claim 1 , further comprising: an underfill between the dummy die and the package substrate and around the dummy connectors, wherein the underfill is sandwiched between the edge molding material and the package molding material.
4. 4 . The package structure as claimed in claim 1 , wherein a width of the edge molding material on one side of the dummy die is ranged from about 1 nm to about 3000 nm.
5. 5 . The package structure as claimed in claim 4 , wherein the width of the edge molding material is variable around the upper portion of the dummy die.
6. 6 . The package structure as claimed in claim 1 , wherein a depth of the upper portion is greater than a depth of the base portion.
7. 7 . A package structure, comprising: a device die bonded to a package substrate; a dummy die bonded to the package substrate and disposed adjacent to the device die, wherein the dummy die comprises: a base portion; an upper portion bonded to the base portion, wherein a width of the upper portion is less than a width of the base portion in a direction perpendicular to a normal direction of the package structure; and an edge molding material formed over an upper surface of the base portion and covering sidewalls of the upper portion; and a package molding material over the package substrate and around the dummy die and the device die.
8. 8 . The package structure as claimed in claim 7 , wherein a depth of the edge molding material is greater than a depth of the upper portion in the normal direction of the package structure.
9. 9 . The package structure as claimed in claim 7 , wherein the upper portion is bonded to the base portion via a bonding film, and the edge molding material covers sidewalls of the bonding film.
10. 10 . The package structure as claimed in claim 7 , wherein the package molding material is in contact with the edge molding material.
11. 11 . The package structure as claimed in claim 10 , further comprising: an underfill between the dummy die, the device die and the package substrate, wherein the underfill extends into a gap between the edge molding material and the package molding material.
12. 12 . The package structure as claimed in claim 7 , wherein the dummy die is disposed closer to a corner of the package substrate than the device die.
13. 13 . The package structure as claimed in claim 7 , wherein a depth of the base portion is ranged from about 100 μm to about 300 μm.
14. 14 . The package structure as claimed in claim 7 , wherein a glass transition temperature of the edge molding material is less than a glass transition temperature of the package molding material.
15. 15 . A method for forming a package structure, comprising: forming a dummy die, comprising: bonding a plurality of upper portions to a base portion via a bonding film; forming an edge molding material over the base portion and around the upper portions; and performing a singulation process along a scribe line between the upper portions to form the dummy die; bonding the dummy die and a device die over a package substrate; forming an underfill between the dummy die and the package substrate, wherein the underfill covers a portion of a sidewall of the edge molding material; and forming a package molding material over the package substrate and around the dummy die and the device die, wherein the package molding material contacts the underfill and the edge molding material.
16. 16 . The method as claimed in claim 15 , wherein forming the dummy die further comprises: forming a plurality of dummy connectors over the base portion; forming an attach film over the dummy connectors; and bonding the base portion to a carrier via the attach film, wherein the upper portions are bonded to the base portion on the carrier.
17. 17 . The method as claimed in claim 16 , wherein forming the dummy die further comprises: removing the attach film to release the base portion from the carrier; placing the upper portions and the base portion on a tape; and performing the singulation process on the tape.
18. 18 . The method as claimed in claim 15 , wherein the edge molding material is formed on each edge of one of the upper portions, wherein a width of the edge molding material is different on each edge of one of the upper portions.
19. 19 . The method as claimed in claim 15 , wherein bonding the dummy die and the device die over the package substrate further comprises: disposing the dummy die closer to a corner of the package substrate than the device die.
20. 20 . The method as claimed in claim 15 , wherein forming the dummy die further comprises: thinning down the base portion before bonding the upper portions to the base portion via the bonding film.

Description

BACKGROUND Semiconductor devices are used in a variety of electronic applications, such as personal computers, cell phones, digital cameras, and other electronic equipment. Semiconductor devices are typically fabricated by sequentially depositing insulating or dielectric layers, conductive layers, and semiconductive layers of material over a semiconductor substrate, and patterning the various material layers using lithography to form circuit components and elements thereon. Many integrated circuits are typically manufactured on a single semiconductor wafer, and individual dies on the wafer are singulated by sawing between the integrated circuits along a scribe line. The individual dies are typically packaged separately, in multi-chip modules, for example, or in other types of packaging. Although existing methods of fabricating semiconductor structures have generally been adequate for their intended purposes, they have not been entirely satisfactory in all respects. BRIEF DESCRIPTION OF THE DRAWINGS Aspects of the present disclosure are best understood from the following detailed description when read with the accompanying figures. It should be noted that, in accordance with standard practice in the industry, various features are not drawn to scale. In fact, the dimensions of the various features may be arbitrarily increased or reduced for clarity of discussion. FIG. 1 illustrates a schematic view of the first package component in accordance with some embodiments. FIGS. 2A through 2E illustrates cross-sectional views of intermediate steps during a process for fabricating a dummy die in accordance with some embodiments. FIG. 3A through 3L illustrates cross-sectional views of intermediate steps during a process for fabricating the package structure along the line A-A shown in FIG. 1 in accordance with some embodiments. FIG. 4 illustrates an enlarged view of the region C shown in FIG. 3L in accordance with some embodiments. FIG. 5 illustrates an enlarged view of the region B shown in FIG. 1 in accordance with some embodiments. DETAILED DESCRIPTION The following disclosure provides many different embodiments, or examples, for implementing different features of the subject matter provided. Specific examples of components and arrangements are described below to simplify the present disclosure. These are, of course, merely examples and are not intended to be limiting. For example, the formation of a first feature over or on a second feature in the description that follows may include embodiments in which the first and second features are formed in direct contact, and may also include embodiments in which additional features may be formed between the first and second features, such that the first and second features may not be in direct contact. In addition, the present disclosure may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. Some variations of the embodiments are described. Throughout the various views and illustrative embodiments, like reference numbers are used to designate like elements. It should be understood that additional operations can be provided before, during, and after the method, and some of the operations described can be replaced or eliminated for other embodiments of the method. Embodiments of package structures and methods for fabricating the same are provided. The package structure includes a dummy die disposed adjacent to the device die, and the dummy die includes an edge molding material on edges of the dummy die. The dummy die is disposed at a corner of the package molding material. The Young's modulus of the edge molding material is less than the Young's modulus of the package molding material around the dummy die and the device die. As a result, the edge molding material of the dummy die can mitigate the coefficient of thermal expansion (CTE) mismatch between the dummy die and the package molding material, and therefore the corner stress of the package structure can be reduced. In this way, cracks or other defects can be minimized for the package structure. FIG. 1 illustrates a schematic view of a first package component 100 in accordance with some embodiments. As shown in FIG. 1 the first package component 100 includes a plurality of dummy dies 70 and a plurality of device dies 50-1, 50-2, and 50-3 that are encapsulated by the package molding material 152. In some embodiments, the dummy dies 70 are located at corners of the first package component 100 (that is, the corners of the package molding material 152), and the device dies 50-1, 50-2, and 50-3 are disposed between two of the dummy dies 70. In some embodiments, the device dies 50-1 are located on upper and lower sides of the first package component 100, the device dies 50-2 are located on left and right sides of the first package component 10