US-20260130274-A1 - ELECTRONIC PACKAGE MODULE AND METHOD FOR FABRICATION OF THE SAME

US20260130274A1US 20260130274 A1US20260130274 A1US 20260130274A1US-20260130274-A1

Abstract

An electronic package module includes a circuit substrate, an electronic component and an encapsulation layer on the circuit substrate, a thermal conductive material inside a cavity of the encapsulation layer and a heat sink on the thermal conductive material. The electronic component has a top surface facing away from the circuit substrate is electronically connected to the circuit substrate. The encapsulation layer encapsulates the electronic component. The bottom surface of the cavity exposes the top surface of the electronic component. The thermal conductive material is at the top surface of the electronic component and has a first surface of the electronic component far away from the electronic component. The encapsulation layer has a second surface far away from the circuit substrate. The first surface is flush with the second surface. The thermal conductive material is between the electronic component and the heat sink.

Inventors

Tsung-Yueh Tsai
CHEN CHENG OU

Assignees

UNIVERSAL GLOBAL TECHNOLOGY (KUNSHAN) CO., LTD.

Dates

Publication Date: 20260507
Application Date: 20250115
Priority Date: 20241106

Claims (10)

1 . An electronic package module, comprising: a circuit substrate; a first electronic component disposed on and electrically connected to the circuit substrate, wherein the first electronic component comprises a first top surface facing away from the circuit substrate; an encapsulation layer disposed on the circuit substrate and encapsulating the first electronic component, wherein the encapsulation layer comprises a cavity located on the first electronic component, and a bottom surface of the cavity exposes the first top surface of the first electronic component; a thermal conductive material disposed inside the cavity of the encapsulation layer and located at the first top surface of the first electronic component, wherein the thermal conductive material comprises a first surface far away from the first electronic component, and the encapsulation layer comprises a second surface far away from the circuit substrate, wherein the first surface is flush with the second surface; and a heat sink disposed on the first surface of the thermal conductive material, and the thermal conductive material is located between the first electronic component and the heat sink.
2 . The electronic package module of claim 1 , wherein a depth of the cavity is larger than a thickness of the first electronic component.
3 . The electronic package module of claim 2 , wherein the depth of the cavity is between 0.5 and 5.0 the size of the thickness of the first electronic component.
4 . The electronic package module of claim 1 , wherein an area of the bottom surface of the cavity is larger than an area of the first top surface of the first electronic component.
5 . The electronic package module of claim 1 , further comprising: a metal layer disposed on the encapsulation layer and covering the first electronic component and the encapsulation layer, wherein a part of the metal layer is located between the first electronic component, and the thermal conductive material, and the part of the metal layer touches the first top surface of the first electronic component and the thermal conductive material directly, wherein the metal layer is electrically connected to the circuit substrate.
6 . The electronic package module of claim 1 , wherein the thermal conductive material comprises a thermal interface material.
7 . The electronic package module of claim 1 , further comprising: a second electronic component disposed on the circuit substrate, wherein the second electronic component comprises a second top surface far away from the circuit substrate, and the second top surface protrudes from the first top surface of the first electronic component, wherein the encapsulation layer covers the second top surface of the second electronic component.
8 . A method for fabricating an electronic package module, comprising: providing an initial circuit substrate; disposing an electronic component on the initial circuit substrate; disposing a releasing material on a top surface of the electronic component after the electronic component is disposed, wherein the releasing material touches the top surface directly; forming an initial encapsulation layer on the initial circuit substrate, so that the initial encapsulation layer encapsulates the electronic component and the releasing material, wherein the initial encapsulation layer comprises a first surface far away from the initial circuit substrate, and the releasing material comprises a second surface far away from the initial circuit substrate, wherein the first surface exposes the second surface, and the first surface is flush with the second surface; removing the releasing material to form a cavity after the initial encapsulation layer is formed, and the top surface of the electronic component is exposed; cutting the initial circuit substrate and the initial encapsulation layer to form a circuit substrate and an encapsulation layer after the cavity is formed; disposing a thermal conductive material inside the cavity; and disposing a heat sink on the thermal conductive material, wherein the thermal conductive material is located between the heat sink and the electronic component.
9 . The method of claim 8 , wherein the releasing material comprises polysiloxanes.
10 . The method of claim 8 , further comprising: depositing a metal layer on the encapsulation layer after the circuit substrate and the encapsulation layer are formed, so that the metal layer covers the encapsulation layer and the top surface of the electronic component; wherein the metal layer is electrically connected to the circuit substrate; wherein a part of the metal layer is located between the electronic component and the thermal conductive material.

Description

RELATED APPLICATIONS This application claims priority to China Application Serial Number 202411572372.1, filed Nov. 6, 2024, which is herein incorporated by reference in its entirety. BACKGROUND Technical Field The present disclosure relates to an electronic package module and the method for fabrication of the same. Description of Related Art With the development of electronic products having diverse functions, the electronic package modules in the electronic products require to accommodate more and more electronic components. Thus, the demand for heat dissipation of the electronic package modules increases. In the electronic package modules with high heat dissipation requirements, the backsides of electronic components that generate more heat (e.g., transistors) are exposed to improve the heat dissipation efficiency. Generally, there are two methods for the backsides of the electronic components to be exposed. The first one is to form concave and convex structures on the mold of the encapsulation process, so that a part of the mold is able to shield and touch the backsides of the electronic components. As a result, the encapsulation material does not cover the backsides of the electronic components. However, if the heights of the electronic components in the electronic package module are inconsistent, different molds are required for the first method, and thereby increasing the costs of fabrication. The second method is to grind or cut the encapsulation material of the electronic package module to expose the backsides of the electronic components. However, the second method is unable to be used under the situation that the height of the electronic components to be exposed is lower than the height of other electronic components. SUMMARY Accordingly, the disclosure is to provide an electronic package module which is helpful to increase the heat dissipation efficiency. At least one embodiment of the disclosure provides a method for fabricating the aforementioned electronic package module. At least one embodiment of the disclosure provides an electronic package module including a circuit substrate, a first electronic component, an encapsulation layer, a thermal conductive material and a heat sink. The first electronic component is disposed on and electrically connected to the circuit substrate, and the first electronic component includes a first top surface facing away from the circuit substrate. The encapsulation layer is disposed on the circuit substrate and encapsulates the first electronic component. The encapsulation layer includes a cavity located on the first electronic component, and a bottom surface of the cavity exposes the first top surface of the first electronic component. The thermal conductive material is disposed inside the cavity of the encapsulation layer and located at the first top surface of the first electronic component. The thermal conductive material includes a first surface far away from the first electronic component, and the encapsulation layer includes a second surface far away from the circuit substrate. The first surface is flush with the second surface. The heat sink is disposed on the first surface of the thermal conductive material, and the thermal conductive material is located between the first electronic component and the heat sink. At least one embodiment of the disclosure provides a method for fabricating an electronic package module including providing an initial circuit substrate. The method includes disposing an electronic component on the initial circuit substrate. The method includes disposing a releasing material on a top surface of the electronic component after the electronic component is disposed, and the releasing material touches the top surface directly. The method includes forming an initial encapsulation layer on the initial circuit substrate, so that the initial encapsulation layer encapsulates the electronic component and the releasing material. The initial encapsulation layer includes a first surface far away from the initial circuit substrate, and the releasing material includes a second surface far away from the initial circuit substrate. The first surface exposes the second surface, and the first surface is flush with the second surface. The method includes removing the releasing material to form a cavity after the initial encapsulation layer is formed, and the top surface of the electronic component is exposed. The method includes cutting the initial circuit substrate and the initial encapsulation layer to form a circuit substrate and an encapsulation layer after the cavity is formed. The method includes disposing a thermal conductive material inside the cavity. The method includes disposing a heat sink on the thermal conductive material, and the thermal conductive material is located between the heat sink and the electronic component. According to the aforementioned embodiments, the top surface of the electronic component is exposed on the bottom sur