US-20260130286-A1 - ILLUMINATOR REPAIRING DEVICE, AND ILLUMINATOR REPAIRING METHOD

US20260130286A1US 20260130286 A1US20260130286 A1US 20260130286A1US-20260130286-A1

Abstract

An illuminator repairing device and an illuminator repairing method are disclosed. The illuminator repairing device includes a laser, a repairing module and a positioning module electrically connected to the laser and the repairing module. The laser is positioned on a first side of a substrate away from a second side of the substrate where connecting pads is attached thereon and configured to irradiate and melt an adhesive block from the first side, thereby releasing a light emitting diode (LED) from a corresponding one of the connecting pads. The repairing module is positioned on the second side of the substrate, and configured to remove the LED released from the corresponding connecting pad. The positioning module is configured to align the laser and the repairing module with the corresponding connecting pad from opposite sides of the substrate.

Inventors

Kuang-Hua Liu
Ming-Yi Hsieh

Assignees

CENTURY TECHNOLOGY (SHENZHEN) CORPORATION LIMITED

Dates

Publication Date: 20260507
Application Date: 20251230
Priority Date: 20220429

Claims (20)

1 . An illuminator repairing device configured for repairing an illuminator, comprising: a laser positioned on a first side of a substrate away from a second side of the substrate, and configured to irradiate and melt an adhesive block from the first side, thereby releasing a light emitting diode (LED) from a corresponding connecting pad of a plurality of connecting pads, wherein the corresponding connecting pad is attached to the second side via the adhesive block; a repairing module positioned on the second side of the substrate, and configured to remove the LED released from the corresponding connecting pad; and a positioning module electrically connected to the laser and the repairing module, and configured to align the laser on the first side and the repairing module on the second side with the corresponding connecting pad from the first side and the second side of the substrate, respectively.
2 . The illuminator repairing device of claim 1 , further comprising a supporting platform configured to secure the illuminator between the laser and the repairing module.
3 . The illuminator repairing device of claim 2 , wherein the supporting platform is further configured to expose each the first side and the second side of the substrate.
4 . The illuminator repairing device of claim 1 , wherein the laser is configured to irradiate the adhesive block through the substrate made of a transparent material.
5 . The illuminator repairing device of claim 1 , wherein the laser is further configured to irradiate the adhesive block through a second well, the second well penetrates the substrate and communicates with a first well defined in the corresponding connecting pad.
6 . The illuminator repairing device of claim 1 , wherein the repairing module is further configured to bond a replacement LED to the corresponding connecting pad after removing the LED.
7 . The illuminator repairing device of claim 6 , wherein the repairing module is further configured for to provide a bonding material to the corresponding connecting pad before bonding the replacement LED.
8 . The illuminator repairing device of claim 1 , wherein the repairing module comprises at least one of a grasping head, a vacuum sucker, or an adhesive probe.
9 . The illuminator repairing device of claim 1 , wherein the laser comprises a carbon dioxide laser or a fiber laser.
10 . The illuminator repairing device of claim 1 , wherein the positioning module comprises a control device configured to cause the laser to move and align with the repairing module.
11 . The illuminator repairing device of claim 10 , wherein the control device is a mechanical arm or a transmission mechanism.
12 . A illuminator repairing method of repairing an illuminator, comprising: irradiating an adhesive block with laser light from a first side of a substrate to melt the adhesive block, wherein a corresponding connecting pad of a plurality of connecting pads is attached to a second side by the adhesive block; releasing a light emitting diode (LED) from the corresponding connecting pad; and removing the LED from the corresponding connecting pad.
13 . The illuminator repairing method of claim 12 , further comprising controlling the laser to irradiate the adhesive block through the substrate made of a transparent material.
14 . The illuminator repairing method of claim 12 , wherein irradiating the adhesive block comprises irradiating the adhesive block through a second well penetrating the substrate and communicating with a first well defined in the corresponding connecting pad.
15 . The illuminator repairing method of claim 12 , further comprising controlling the laser to irradiate the adhesive block without melting the substrate and the plurality of connecting pads.
16 . The illuminator repairing method of claim 12 , wherein irradiating the adhesive block and removing the LED are performed simultaneously.
17 . The illuminator repairing method of claim 12 , further comprising: before irradiating the adhesive block, locating the LED and aligning the laser with the adhesive block.
18 . The illuminator repairing method of claim 12 , further comprising: before irradiating the adhesive block, securing the illuminator on a supporting platform between a laser and a repairing module, such that the first side and the second side of the substrate are exposed by the supporting platform.
19 . The illuminator repairing method of claim 12 , further comprising: after removing the LED, bonding a replacement LED to the corresponding connecting pad.
20 . The illuminator repairing method of claim 19 , further comprising: before bonding the replacement LED, providing a bonding material to the corresponding connecting pad.

Description

FIELD The subject matter herein generally relates to displays, specifically to an illuminator repairing device, and an illuminator repairing method. BACKGROUND Existing illuminator repairing methods usually use laser to irradiate a damaged light emitting diode (LED) directly, so that the LED can be removed after destroying the adhesive material used to bond the LED. However, because the LED is between the laser and the adhesive material, the LED will adsorb a lot of heat in the process of destroying the adhesive material, such a method not only result in high energy consumption, but may also causes damages to the illuminator. Moreover, in order to prevent the high energy laser from affecting the adjacent LEDs, the illuminators usually set a large distance between two adjacent LEDs, which limits the resolution of the illuminators. BRIEF DESCRIPTION OF THE DRAWINGS Implementations of the present technology will now be described, by way of example only, with reference to the attached figures, wherein: FIG. 1 is a top view of an illuminator according to an embodiment of the present disclosure. FIG. 2 is a cross-sectional view of the illuminator shown in FIG. 1, taken along line II-II. FIG. 3 is a cross-sectional view of an illuminator according to another embodiment of the present disclosure. FIG. 4 is a cross-sectional view of an illuminator repairing device according to an embodiment of the present disclosure. FIG. 5 is a flow chart of an illuminator repairing method according to an embodiment of the present disclosure. DETAILED DESCRIPTION It will be appreciated that for simplicity and clarity of illustration, where appropriate, reference numerals have been repeated among the different figures to indicate corresponding or analogous elements. In addition, numerous specific details are set forth in order to provide a thorough understanding of the embodiments described herein. However, it will be understood by those of ordinary skill in the art that the embodiments described herein can be practiced without these specific details. In other instances, methods, procedures and components have not been described in detail so as not to obscure the related relevant feature being described. Also, the description is not to be considered as limiting the scope of the embodiments described herein. The drawings are not necessarily to scale and the proportions of certain parts have been exaggerated to better illustrate details and features of the present disclosure. Several definitions that apply throughout this disclosure will now be presented. The term “coupled” is defined as connected, whether directly or indirectly through intervening components, and is not necessarily limited to physical connections. The connection can be such that the objects are permanently connected or releasably connected. The term “outside” refers to a region that is beyond the outermost confines of a physical object. The term “inside” indicates that at least a portion of a region is partially contained within a boundary formed by the object. The term “substantially” is defined to be essentially conforming to the particular dimension, shape or other word that substantially modifies, such that the component need not be exact. For example, “substantially cylindrical” means that the object resembles a cylinder, but can have one or more deviations from a true cylinder. The term “comprising,” when utilized, means “including, but not necessarily limited to”; it specifically indicates open-ended inclusion or membership in the so-described combination, group, series and the like. Optional” or “optionally” means that the subsequently described circumstance may or may not occur, so that the description includes instances where the circumstance occurs and instances where it does not. When a feature or element is herein referred to as being “on” another feature or element, it can be directly on the other feature or element, or intervening features and/or elements may also be present. It will also be understood that, when a feature or element is referred to as being “connected”, “attached” or “coupled” to another feature or element, it can be directly connected, attached or coupled to the other feature or element or intervening features or elements may be present. FIG. 1 and FIG. 2 illustrate a top view and a cross-sectional view of an illuminator 100 according to a first embodiment of the present disclosure, respectively. The illuminator 100 includes a substrate 110, a plurality of connecting pads 130, a plurality of LEDs 170, and a plurality of adhesive blocks 150. The plurality of connecting pads 130 is arranged as an array and mounted on the substrate 110. Each connecting pad 130 defines a first well 132. Each LED 170 is attached to a connecting pad 130. Each adhesive blocks 150 is between a connecting pad 130 and a LED 190 to bond the LED 170 on the connecting pad 130. The adhesive blocks 150 at least covers the first well 132, so that a light can shine on