US-20260130297-A1 - ELECTRONIC DEVICE

US20260130297A1US 20260130297 A1US20260130297 A1US 20260130297A1US-20260130297-A1

Abstract

An electronic device includes an electronic component, a sealing resin, and a lead with an inner portion and an outer portion. The inner portion includes a die pad portion on which the electronic component is mounted, and a connecting portion that connects the outer portion and the die pad portion. The outer portion is disposed on a side of a first direction relative to the die pad portion. The connecting portion is connected to a side surface of the die pad portion. In a second direction, the center of the outer portion is disposed on a side of the second direction relative to the center of the die pad portion. The side surface includes a connecting section connected to the connecting portion and a pair of lateral sections disposed on both sides of the connecting section in the second direction.

Inventors

Ryohei Umeno

Assignees

ROHM CO., LTD.

Dates

Publication Date: 20260507
Application Date: 20251229
Priority Date: 20230704

Claims (16)

1 . An electronic device comprising: a first electronic component; a sealing resin covering the electronic component; and a first lead including a first inner portion covered by the sealing resin and a first outer portion exposed from the sealing resin, wherein the first inner portion includes a first die pad portion on which the electronic component is mounted, and a first connecting portion that connects the first outer portion and the first die pad portion to each other, the first outer portion is disposed on a first side of a first direction perpendicular to a thickness direction of the electronic component relative to the first die pad portion, the first die pad portion includes a first side surface facing a side where the first outer portion is located in the first direction, the first connecting portion is connected to the first side surface, in a second direction perpendicular to the first direction, a center of the first outer portion is disposed on a first side of the second direction relative to a center of the first die pad portion, and the first side surface includes a connecting section connected to the first connecting portion, and a pair of lateral sections disposed on respective sides of the connecting section in the second direction.
2 . The electronic device according to claim 1 , wherein the first die pad portion is rectangular as viewed in the thickness direction, as viewed in the thickness direction, the first die pad portion includes a first corner located on the first side of the first direction and the first side of the second direction, and a second corner located diagonally opposite to the first corner.
3 . The electronic device according to claim 2 , wherein the first inner portion and the first outer portion define a boundary having a center as a first connection point, the first connecting portion and the first die pad portion define a boundary having a center as a second connection point, as viewed in the thickness direction, the first connection point, the second connection point and the second corner lie on a single straight line.
4 . The electronic device according to claim 1 , wherein the connecting section is disposed on the first side of the second direction relative to a center of the first side surface in the second direction.
5 . The electronic device according to claim 1 , wherein the connecting section and the electronic component are spaced apart from each other in the first direction as viewed in the thickness direction.
6 . The electronic device according to claim 1 , wherein the first connecting portion is inclined relative to the first side surface as viewed in the thickness direction.
7 . The electronic device according to claim 6 , wherein an inclination angle of the first connecting portion relative to the first side surface is at least 10° and at most 89°.
8 . The electronic device according to claim 1 , further comprising: a second lead spaced apart from the first lead; and a connecting member bonded to the second lead and the electronic component, wherein the second lead includes a second inner portion covered by the sealing resin and a second outer portion exposed from the sealing resin, and the connecting member is covered by the sealing resin and bonded to the second inner portion.
9 . The electronic device according to claim 8 , wherein the sealing resin includes a first resin side surface facing the first side of the first direction, and the first lead and the second lead protrude from the first resin side surface.
10 . The electronic device according to claim 9 , further comprising a plurality of third leads spaced apart from the first lead and the second lead, wherein the each of the plurality of third leads includes a third inner portion covered by the sealing resin and a third outer portion exposed from the sealing resin.
11 . The electronic device according to claim 10 , wherein the plurality of third leads protrude from the first resin side surface, and the first outer portion is disposed on the first side of the second direction relative to the second outer portion and the third outer portions of the plurality of third leads.
12 . The electronic device according to claim 10 , wherein the sealing resin includes a second resin side surface facing away from the first resin side surface in the first direction, the plurality of third leads protrude from the second resin side surface as viewed in the thickness direction.
13 . The electronic device according to claim 12 , wherein the first outer portion and the second outer portion are adjacent to each other with a first spacing in the second direction, the third outer portions of the plurality of third leads are mutually spaced apart with a second spacing in the second direction, and the first spacing is greater than the second spacing.
14 . The electronic device according to claim 13 , further comprising a pair of fourth leads each including a fourth inner portion covered by the sealing resin and a fourth outer portion exposed from the sealing resin, wherein each of the pair of fourth leads is spaced apart from the first lead, the second lead and the plurality of third leads, and protrudes from the second resin side surface as viewed in the thickness direction, and the fourth outer portions of the pair of fourth leads are disposed on respective sides of the third outer portions of the plurality of third leads in the first direction.
15 . The electronic device according to claim 14 , further comprising a second electronic component in addition to the first electronic component, wherein the pair of fourth leads are spaced apart from each other, and in one of the pair of fourth leads, the fourth inner portion includes a second die pad portion on which the second electronic component is mounted, and a second connecting portion that connects the fourth outer portion and the second die pad portion to each other.
16 . The electronic device according to claim 15 , wherein the second die pad portion includes a second side surface facing a side where the fourth outer portion of the one of the pair of fourth leads is located in the first direction, the second connecting portion is connected to the second side surface, and a center of the fourth outer portion of the one of the pair of fourth leads is offset relative to a center of the second die pad portion in the second direction.

Description

TECHNICAL FIELD The present disclosure relates to electronic devices BACKGROUND ART Conventionally, semiconductor devices manufactured using lead frames are known as one type of electronic device. An example of such a semiconductor device is disclosed in JP-A-2022-55599. The semiconductor device disclosed in JP-A-2022-55599 is configured to be surface-mounted on a wiring board of an inverter device and comprises a first semiconductor element, a conductive support member, and a sealing resin. The conductive support member is formed from a single lead frame. The conductive support member includes a first die pad and input terminals. The first semiconductor element is mounted on the first die pad. The input terminals include some terminals connected to the first die pad. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a plan view showing an electronic device of a first embodiment FIG. 2 shows the plan view of FIG. 1 with the sealing resin depicted with imaginary lines. FIG. 3 is an enlarged plan view of a portion of FIG. 2. FIG. 4 is an enlarged plan view of a portion of FIG. 2. FIG. 5 is a front view showing the electronic device of the first embodiment. FIG. 6 is a rear view of the electronic device of the first embodiment. FIG. 7 is a left side view of the electronic device of the first embodiment. FIG. 8 is a right side view of the electronic device of the first embodiment. FIG. 9 is a cross-sectional view along line IX-IX in FIG. 2. FIG. 10 is a cross-sectional view along line X-X in FIG. 2. FIG. 11 is a perspective view showing the first die pad portion and the first electronic component in the electronic device of the first embodiment. FIG. 12 is a perspective view showing the second die pad portion and the second electronic component in the electronic device of the first embodiment. FIG. 13 shows the circuit configuration of the first electronic component and the second electronic component in the electronic device of the first embodiment. FIG. 14 is a plan view showing a process for manufacturing the electronic device of the first embodiment. FIG. 15 is a plan view showing an electronic device of a first variation of the first embodiment, wherein the sealing resin is shown by imaginary lines. FIG. 16 is a front view showing the electronic device of the first variation of the first embodiment. FIG. 17 is a rear view of the electronic device of the first variation of the first embodiment. FIG. 18 is a plan view showing an electronic device of a second variation of the first embodiment, with the sealing resin indicated by imaginary lines. FIG. 19 is a plan view showing an electronic device of a third variation of the first embodiment, with the sealing resin indicated by imaginary lines. FIG. 20 is a plan view showing an electronic device of a fourth variation of the first embodiment, wherein the sealing resin is shown by imaginary lines. FIG. 21 shows the circuit configuration of the first electronic component and the second electronic component in the electronic device of the fourth variation of the first embodiment. FIG. 22 is a plan view showing an electronic device based on another configuration of the fourth variation, wherein the sealing resin is shown by imaginary lines. FIG. 23 is a plan view showing main parts of an electronic device of a second embodiment. FIG. 24 is a plan view showing main parts of the electronic device of the second embodiment. DETAILED DESCRIPTION OF EMBODIMENTS Preferred embodiments of electronic devices of the present disclosure will be described below with reference to the drawings. Hereinafter, identical or similar components will be designated by the same reference numerals to avoid redundant descriptions. The terms “first,” “second,” “third,” etc., in the present disclosure are used merely as labels and do not necessarily imply any particular order of the objects they refer to. In the description of the present disclosure, the expression “An object A is formed in an object B”, and “An object A is formed on an object B” imply the situation where, unless otherwise specifically noted, “the object A is formed directly in or on the object B”, and “the object A is formed in or on the object B, with something else interposed between the object A and the object B”. Likewise, the expression “An object A is disposed in an object B”, and “An object A is disposed on an object B” imply the situation where, unless otherwise specifically noted, “the object A is disposed directly in or on the object B”, and “the object A is disposed in or on the object B, with something else interposed between the object A and the object B”. Further, the expression “An object A is located on an object B” implies the situation where, unless otherwise specifically noted, “the object A is located on the object B, in contact with the object B”, and “the object A is located on the object B, with something else interposed between the object A and the object B”. Still further, the expression “An object A overla