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US-20260130299-A1 - Integrated Process Sequence for Hybrid Bonding Applications

US20260130299A1US 20260130299 A1US20260130299 A1US 20260130299A1US-20260130299-A1

Abstract

A method for sequencing a hybrid bonding process by double linking a source of dies and a target. The method may include selecting a source of dies for bonding, selecting a target on which the dies will be bonded, linking the source to the target, linking the target to the source, forming an integrated bonding product sequence that includes a first linked bonding sequence for the source and a second linked bonding sequence for the target, determining bonding process chamber allocations and process timing for the source and the target based on the integrated bonding product sequence, and bonding a die from the source to the target using the integrated bonding product sequence.

Inventors

  • Niranjan PINGLE
  • Jitendra Ratilal BHIMJIYANI
  • Shreshtha Kumar JAISWAL

Assignees

  • APPLIED MATERIALS, INC.

Dates

Publication Date
20260507
Application Date
20260105

Claims (20)

  1. 1 . A method for sequencing a hybrid bonding process, comprising: forming an integrated bonding product sequence comprising at least one first bonding sequence for at least one source of dies and a second bonding sequence for a target, wherein at least one die from the at least one source of dies is to be bonded to the target; and determining bonding process chamber allocations for the at least one source of dies and the target based on the integrated bonding product sequence.
  2. 2 . The method of claim 1 , wherein determining bonding process chamber allocations includes accounting for activation queue time of the at least one source of dies and activation queue time of the target.
  3. 3 . The method of claim 1 , wherein determining bonding process chamber allocations includes accounting for maximum utilization of at least one hybrid bonding process chamber.
  4. 4 . The method of claim 3 , wherein determining bonding process chamber allocations includes accounting for just-in-time consumption for maximum utilization of the at least one hybrid bonding process chamber.
  5. 5 . The method of claim 1 , wherein determining bonding process chamber allocations includes accounting for process chamber recipes and motion control durations.
  6. 6 . The method of claim 1 , wherein determining bonding process chamber allocations includes accounting for robot transfer speeds.
  7. 7 . The method of claim 1 , wherein determining bonding process chamber allocations includes accounting for die level constitution of materials of the at least one source of dies.
  8. 8 . The method of claim 1 , wherein determining bonding process chamber allocations includes accounting for die maps for locating dies on the target.
  9. 9 . The method of claim 1 , further comprising: comparing the integrated bonding product sequence with a user supplied bonding sequence; determining differences between the integrated bonding product sequence and the user supplied bonding sequence; and notifying the user of the differences and compatibility with a hybrid bonding tool.
  10. 10 . The method of claim 9 , further comprising: notifying a user of throughput level or bonder utilization level compared to the integrated bonding product sequence.
  11. 11 . The method of claim 1 , further comprising: accepting at least one recipe input for at least one process chamber; accepting at least one die map input for the target; accepting at least one process sequence input for bonding; and determining bonding process chamber allocations based on the at least one recipe input, the at least one die map input, or the at least one process sequence input.
  12. 12 . A method for sequencing a hybrid bonding process, comprising: forming an integrated bonding product sequence comprising at least one first bonding sequence for at least one source of dies and a second bonding sequence for a target, wherein at least one die from the at least one source of dies is to be bonded to the target; determining bonding process chamber allocations for the at least one source of dies and the target based on the integrated bonding product sequence; and comparing the integrated bonding product sequence with a user supplied bonding sequence; determining differences between the integrated bonding product sequence and the user supplied bonding sequence; and notifying the user of the differences and compatibility with a hybrid bonding tool.
  13. 13 . The method of claim 12 , further comprising: notifying a user of throughput level or bonder utilization level compared to the integrated bonding product sequence.
  14. 14 . The method of claim 12 , further comprising: accepting at least one recipe input for at least one process chamber; accepting at least one die map input for the target; accepting at least one process sequence input for bonding; and determining bonding process chamber allocations based on the at least one recipe input, the at least one die map input, or the at least one process sequence input.
  15. 15 . The method of claim 12 , wherein determining bonding process chamber allocations includes accounting for activation queue time of the at least one source of dies and activation queue time of the target.
  16. 16 . The method of claim 12 , wherein determining bonding process chamber allocations includes accounting for maximum utilization of at least one hybrid bonding process chamber.
  17. 17 . The method of claim 12 , wherein determining bonding process chamber allocations includes at least one of a, b, c, or d: (a) accounting for process chamber recipes and motion control durations; (b) accounting for robot transfer speeds; (c) accounting for die level constitution of materials of the at least one source of dies; or (d) accounting for die maps for locating dies on the target.
  18. 18 . A non-transitory, computer readable medium having instructions stored thereon that, when executed, cause a method for sequencing a hybrid bonding process to be performed, the method comprising: forming an integrated bonding product sequence comprising at least one first bonding sequence for at least one source of dies and a second bonding sequence for a target, wherein at least one die from the at least one source of dies is to be bonded to the target; and determining bonding process chamber allocations for the at least one source of dies and the target based on the integrated bonding product sequence.
  19. 19 . The non-transitory, computer readable medium of claim 18 , wherein determining bonding process chamber allocations and process timing includes at least one of a, b, c, d, e, f, and g: (a) accounting for activation queue time of the at least one source of dies and activation queue time of the target; (b) accounting for maximum utilization of at least one hybrid bonding process chamber; (c) accounting for just-in-time consumption for maximum utilization of the at least one hybrid bonding process chamber; (d) accounting for process chamber recipes and motion control durations; (e) accounting for robot transfer speeds; (f) accounting for die level constitution of materials of the at least one source of dies; or (g) accounting for die maps for locating dies on the target.
  20. 20 . The non-transitory, computer readable medium of claim 18 , the method further comprising: comparing the integrated bonding product sequence with a user supplied bonding sequence; determining differences between the integrated bonding product sequence and the user supplied bonding sequence; and notifying the user of the differences and compatibility with a hybrid bonding tool.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS This application is a continuation of co-pending U.S. patent application Ser. No. 18/078,416, filed Dec. 9, 2022, which the patent application is herein incorporated by reference. FIELD Embodiments of the present principles generally relate to semiconductor processing of semiconductor substrates. BACKGROUND Hybrid bonding is the bonding of more than one type of material in a single bonding process. For example, a die may be formed of a dielectric material and have copper contacts. A substrate may also be formed of a dielectric material and have copper contacts. When the die is bonded to the substrate, the dielectric material of the die bonds to the dielectric material of the substrate and the contacts of the die bond to the contacts of the substrate. In order to form a proper bond, both the die and the substrate undergo bonding preparation processes (activation) which involve several different types of process chambers. The substrate holding the dies undergoes a different preparation process than the substrate to which the dies will be bonded. When using a traditional standalone bonder in a simplistic bonding process, the processes of the die and substrate can be easily coordinated, as there is no in tool activation involved, so that each will be ready for insertion into the bonder. However, the inventors have observed, that as multiple sources of dies are needed for bonding to the substrate, coordinating the inline activation processes becomes extremely difficult, if not impossible. Accordingly, the inventors have provided methods for improving hybrid bonding sequences with the capability to account for complex multiple die sources within reasonable queue time while optimizing the throughput of integrated hybrid bonding tools. SUMMARY Methods for sequencing a hybrid bonding process for an integrated hybrid bonding tool are provided herein. In some embodiments, a method for sequencing a hybrid bonding process may comprise selecting a source of dies for bonding, selecting a target on which the dies will be bonded, linking the source to the target, linking the target to the source, forming an integrated bonding product sequence that includes at least one first linked bonding sequence for the source and a second linked bonding sequence for the target, determining bonding process chamber allocations and process timing for the source and the target based on the integrated bonding product sequence, and bonding the die from the source to the target using the integrated bonding product sequence. In some embodiments, a method for sequencing a hybrid bonding process may comprise selecting a source of dies for bonding, selecting a target on which the dies will be bonded, linking the source to the target, linking the target to the source, forming an integrated bonding product sequence that includes a first linked bonding sequence for the source and a second linked bonding sequence for the target, determining bonding process chamber allocations and process timing for the source and the target based on the integrated bonding product sequence, comparing the integrated bonding product sequence with a user supplied bonding sequence, determining differences between the integrated bonding product sequence and the user supplied sequence, and notifying the user of the differences and compatibility with a hybrid bonding tool. In some embodiments, a non-transitory, computer readable medium having instructions stored thereon that, when executed, cause a method for sequencing a hybrid bonding process to be performed, the method may comprise selecting a source of dies for bonding, selecting a target on which the dies will be bonded, linking the source to the target, linking the target to the source, forming an integrated bonding product sequence that includes at least one first linked bonding sequence for the source and a second linked bonding sequence for the target, determining bonding process chamber allocations and process timing for the source and the target based on the integrated bonding product sequence, and bonding the die from the source to the target using the integrated bonding product sequence. Other and further embodiments are disclosed below. BRIEF DESCRIPTION OF THE DRAWINGS Embodiments of the present principles, briefly summarized above and discussed in greater detail below, can be understood by reference to the illustrative embodiments of the principles depicted in the appended drawings. However, the appended drawings illustrate only typical embodiments of the principles and are thus not to be considered limiting of scope, for the principles may admit to other equally effective embodiments. FIG. 1 depicts a process flow for hybrid bonding in accordance with some embodiments of the present principles. FIG. 2 depicts an isometric view of bonding surfaces for a die and a substrate in accordance with some embodiments of the present principles. FIG. 3 depicts a schematic view of a