US-D1126264-S1 - Heat curing board

Inventors

• Hua Liao
• Ting Xiang

Assignees

• SainStore Technology Co., Ltd.

Dates

Publication Date

20260512

Application Date

20240509

Claims (1)

1. The ornamental design for a heat curing board, as shown and described.

Description

FIG. 1 is a perspective view of a heat curing board showing our new design. FIG. 2 is a front view thereof. FIG. 3 is a rear view thereof. FIG. 4 is a left side view thereof. FIG. 5 is a right side view thereof. FIG. 6 is a top view thereof. FIG. 7 is a bottom view thereof. FIG. 8 is a left, bottom perspective view thereof. FIG. 9 is an enlarged detail view of area 9 shown in FIG. 1. FIG. 10 is an enlarged detail view of area 10 shown in FIG. 2; and, FIG. 11 is an enlarged detail view of area 11 shown in FIG. 6.