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WO-2026094435-A1 - RESIN COMPOSITION, ADHESIVE, SEALING MATERIAL, CURED PRODUCT, ELECTRONIC COMPONENT, AND SEMICONDUCTOR DEVICE

WO2026094435A1WO 2026094435 A1WO2026094435 A1WO 2026094435A1WO-2026094435-A1

Abstract

Provided is a resin composition capable of suppressing bleeding on a ceramic substrate during thermal curing.　This resin composition comprises: (A) an epoxy resin; (B) a curing agent; and (C) a rheology controlling agent, the component (C) satisfying the feature (1). Feature (1): When 1 μL of a composition containing 99 g of a bisphenol F epoxy resin and 1 g of the component (C) is formed at the tip of a Cathelin needle at room temperature, and the contact angle θ1 measured 6 seconds after droplet deposition on a ceramic substrate is taken as 100%, the contact angle θ3 measured 5 minutes after the droplet deposition is 88%-100%.

Inventors

  • NAITO, YOTA

Assignees

  • ナミックス株式会社

Dates

Publication Date
20260507
Application Date
20250910
Priority Date
20241101

Claims (13)

  1. (A) Epoxy resin, (B) Hardener, (C) Contains a rheology control agent, The aforementioned component (C) has the following characteristic (1): Resin composition. Feature (1): When 1 μL of a composition consisting of 99 g of bisphenol F type epoxy resin and 1 g of component (C) is formed on the tip of a Catelan needle at room temperature and dropped onto a ceramic substrate, and the contact angle θ1 6 seconds after dropping is set to 100%, the contact angle θ3 5 minutes after dropping is 88% to 100%.
  2. The resin composition according to claim 1, wherein the contact angle θ3 of component (C) is 45° to 65°.
  3. The resin composition according to claim 1 or 2, wherein the contact angle θ1 of component (C) is 47° to 70°.
  4. The resin composition according to any one of claims 1 to 3, wherein, in the characteristic (1) of component (C), when the contact angle θ1 is set to 100%, the contact angle θ2 one minute after droplet placement is 90% to 100%.
  5. The resin composition according to any one of claims 1 to 4, wherein component (B) comprises at least one curing agent selected from the group consisting of imidazole-based curing agents, phenol-based curing agents, and acid anhydride-based curing agents.
  6. A resin composition according to any one of claims 1 to 5, comprising 0.01 to 5 parts by mass of component (C) per 100 parts by mass of component (A).
  7. Furthermore, the resin composition according to any one of claims 1 to 6, further comprising (D) a filler.
  8. The resin composition according to claim 7, wherein the total resin composition comprises 100 parts by mass, and contains 20 to 65% by mass of component (D).
  9. The resin composition according to claim 7 or 8, comprising 0.005 to 3 parts by mass of component (C) per 100 parts by mass of the total of component (A) and component (D).
  10. The resin composition according to any one of claims 1 to 9, wherein the viscosity measured with an E-type viscometer at 25°C and 50 rpm is 1 to 100 Pa·s.
  11. An adhesive or sealant comprising the resin composition described in any one of claims 1 to 10.
  12. A resin composition according to any one of claims 1 to 10, or a cured product obtained by curing the adhesive or sealant according to claim 11.
  13. A semiconductor device or electronic component comprising the cured product described in claim 12.

Description

Resin compositions, adhesives, sealants, cured products, electronic components, and semiconductor devices. This invention relates to resin compositions containing epoxy resin, adhesives, encapsulants, cured products, electronic components, and semiconductor devices. Conventionally, resin compositions containing epoxy resins have been used as adhesives and encapsulants for electronic components and semiconductor products. One of the challenges with these resin compositions is bleeding (the phenomenon of the resin composition seeping out) during thermal curing after application. When bleeding occurs, it can reach surrounding wiring or other components, potentially affecting the characteristics and reliability of the device. In recent years, with the miniaturization of electronic components and semiconductor devices, the distances between wiring and components have become extremely small, making the effects of bleeding even more pronounced. Furthermore, ceramic substrates are widely used as materials in electronic components and semiconductor devices due to their insulating properties, low CTE, and high reliability. Patent Document 1 describes a technique for suppressing bleeding by adding nanofillers with an average particle size of 10 to 100 nm. The embodiments of the present invention (hereinafter referred to as "these embodiments") will be described below. This embodiment relates to a resin composition, an adhesive, a encapsulant, cured products thereof, and electronic components and semiconductor devices containing the cured products. This embodiment does not limit the present invention. [Definition] In this specification, ○ to △ (for example, ○ parts by mass to △ parts by mass) means ○ or more and △ or less (○ parts by mass or more and △ parts by mass or less). In the numerical ranges described in stages in this specification, the upper or lower limit of one numerical range may be replaced with the upper or lower limit of another numerical range described in stages. Furthermore, in the numerical ranges described in this specification, the upper or lower limit of that range may be replaced with the values shown in the examples. Furthermore, in this specification, the terms "includes" or "contains" mean that the specified components are included, but do not exclude the existence of other components. Furthermore, in this specification, the expression "A and/or B" includes "A only,""Bonly," and "both A and B." Furthermore, in this specification, "room temperature" means 25°C. [Resin composition] The resin composition of this embodiment comprises (A) epoxy resin, (B) curing agent, and (C) rheology control agent, wherein component (C) has the following characteristic (1). Feature (1): When 1 μL of a composition consisting of 99 g of bisphenol F type epoxy resin and 1 g of component (C) is formed on the tip of a Catelan needle at room temperature and dropped onto a ceramic substrate, and the contact angle θ1 6 seconds after dropping is set to 100%, the contact angle θ3 5 minutes after dropping is 88% to 100%. The resin composition of this embodiment contains a rheology control agent (C) having feature (1), which suppresses bleeding during thermal curing on the ceramic substrate. Here, suppression of bleeding means that the occurrence of bleeding is suppressed compared to the case where the rheology control agent (C) having feature (1) is not included. For example, if the bleed length is shorter when measuring the bleed length, it can be determined that bleeding has been suppressed. <(A) Epoxy resin> Epoxy resins are a general term for thermosetting resins that can be cured by crosslinking and networking epoxy groups present in the molecule, and include prepolymer compounds before curing. Considering the need to ensure heat resistance, epoxy resins having 2 to 6 epoxy groups are more preferable, and those having 2 epoxy groups are even more preferable. Epoxy resins may be liquid or solid at 25°C, but it is preferable to include epoxy resins that are liquid at 25°C. Epoxy resins are broadly classified into aromatic epoxy resins and epoxy resins that do not contain aromatic rings. Aromatic epoxy resins are epoxy resins that have a structure containing aromatic rings such as benzene rings. Examples of aromatic epoxy resins include: - Bisphenol A type epoxy resin; Branched polyfunctional bisphenol A type epoxy resins such as -p-glycidyloxyphenyldimethyltrisbisphenol A diglycidyl ether; - Bisphenol F type epoxy resin; - Novolac type epoxy resin; - Tetrabromobisphenol A type epoxy resin; - Fluorene-type epoxy resin; - Biphenyl aralkyl epoxy resin; Diepoxy compounds such as -1,4-phenyldimethanol diglycidyl ether; Biphenyl-type epoxy resins such as -3,3',5,5'-tetramethyl-4,4'-diglycidyloxybiphenyl; Examples include, but are not limited to, glycidylamine-type epoxy resins such as diglycidylaniline, diglycidyltoluidine, triglycidyl-p-aminophenol, and tetraglycidyl-m-xylylenediamine; and naphthalene ring-containing epoxy r