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WO-2026094561-A1 - PACKAGE FOR HOUSING OPTICAL ELEMENT, ELECTRONIC DEVICE, AND ELECTRONIC MODULE

WO2026094561A1WO 2026094561 A1WO2026094561 A1WO 2026094561A1WO-2026094561-A1

Abstract

The present invention improves a heat dissipation property. A package (10) for housing an optical element has a metal plate (2) and a wiring board (3). The metal plate (2) includes: a mounting region (23) on which an optical element (70) is mounted; and an extension section (26) that, in plan view, extends from the wiring board (3) in a first direction. The wiring board (3) has a first base part (312) that is located in a section of the periphery of the mounting region (23) and that is open at least in the first direction when viewed from the mounting region (23).

Inventors

  • YONEDA, Ayumu
  • HASHIMOTO, MAKOTO

Assignees

  • 京セラ株式会社

Dates

Publication Date
20260507
Application Date
20251007
Priority Date
20241028

Claims (13)

  1. A metal plate having a first upper surface and a first lower surface opposite the first upper surface, and having a mounting area on the first upper surface where an optical element is mounted, The system comprises a wiring board having connecting electrodes that are electrically connected to the optical element, The wiring board has a first base portion on its first upper surface that is located in a part of the periphery of the mounting area and is open in at least a first direction when viewed from the mounting area. The aforementioned metal plate has an extended portion that extends in a first direction from the wiring board in a plan view, wherein it is a package for housing an optical element.
  2. The optical element housing package according to claim 1, wherein the wiring board has a second base located below the first base and to the side of the metal plate.
  3. The aforementioned wiring board has a second upper surface and a second lower surface opposite to the second upper surface, The optical element housing package according to claim 2, wherein an external electrode for connecting to the outside is located on the second lower surface.
  4. The optical element housing package according to claim 2 or 3, wherein the second base portion has a notch that opens opposite the side surface of the metal plate.
  5. The metal plate has a main portion located to the side of the second base, If the direction parallel to the first upper surface and perpendicular to the first direction is defined as the width direction, The optical element housing package according to any one of claims 2 to 4, wherein the length in the width direction of the extension portion is greater than the length in the width direction of the main portion.
  6. The optical element housing package according to any one of claims 2 to 5, wherein the metal plate has a second extended portion that extends in a second direction opposite to the first direction from the wiring board in a plan view.
  7. The metal plate has a main portion located to the side of the second base, If the direction parallel to the first upper surface and perpendicular to the first direction is defined as the width direction, The optical element housing package according to claim 6, wherein the length in the width direction of the second extension portion is greater than the length in the width direction of the main portion.
  8. The optical element housing package according to claim 1, wherein the side surface of the metal plate is not covered by the wiring board.
  9. The aforementioned wiring board has a second upper surface and a second lower surface opposite to the second upper surface, The optical element housing package according to any one of claims 1 to 8, wherein an external electrode for connecting to the outside is located on the second upper surface.
  10. The optical element housing package according to any one of claims 1 to 9, wherein the first base portion has a shape in which, in a plan view, one of the four sides forming a rectangle is open, located in the first direction.
  11. The optical element housing package according to claim 10, wherein the inner wall located in the second direction opposite to the first direction in the first base portion has an inclination.
  12. A package for housing an optical element according to any one of claims 1 to 11, At least one optical element located in the aforementioned mounting area, An electronic device comprising an optical element that adjusts the light emitted from the aforementioned optical element.
  13. An electronic module configured by connecting multiple electronic devices as described in claim 12.

Description

Packages for housing optical elements, electronic devices, and electronic modules This disclosure relates to optical element housing packages, electronic devices, and electronic modules. As a package for housing a side-emitting optical element, for example, the packages described in Patent Documents 1, 2, and 3 are known as prior art. A package for housing an optical element according to one aspect of this disclosure comprises a metal plate having a first upper surface and a first lower surface opposite the first upper surface, with a mounting area on the first upper surface on which an optical element is mounted, and a wiring board having connecting electrodes electrically connected to the optical element. The wiring board has a first base portion on the first upper surface, located in a part of the periphery of the mounting area, and at least open in a first direction when viewed from the mounting area. The metal plate has an extended portion in a plan view that extends from the wiring board in a first direction. An electronic device according to one aspect of this disclosure comprises an optical element housing package, at least one optical element located in the mounting area, and an optical member for adjusting the light emitted from the optical element. An electronic module according to one aspect of this disclosure is configured by connecting multiple such electronic devices. This is a perspective view of the electronic device according to Embodiment 1.This is an exploded perspective view of the package according to Embodiment 1.This is a lower perspective view of the wiring board according to Embodiment 1.This is a bottom view of the package according to Embodiment 1.This is a side view showing an example of how the electronic device according to Embodiment 1 is mounted on a mounting substrate.This is a bottom perspective view of another embodiment of the wiring board according to Embodiment 1.This is an exploded perspective view of the package according to Embodiment 2.This is a plan view of the package according to Embodiment 3.This is an exploded perspective view of the package according to Embodiment 4.This is a perspective view of the package according to Embodiment 5.This is a side view showing an example of how the electronic device according to Embodiment 5 is mounted on a mounting board.This is a perspective view of the package according to Embodiment 6.This is a plan view of an exemplary wiring board according to Embodiment 7.This is a plan view of an exemplary wiring board according to Embodiment 7.These are a plan view and a cross-sectional view of an exemplary wiring board according to Embodiment 7.This is a perspective view of the electronic module according to Embodiment 8.This is a perspective view of the electronic device according to Embodiment 9.This is a perspective view of the package according to Embodiment 10.This is a bottom view of the package according to Embodiment 10.This is a side view showing an example of how the electronic device according to Embodiment 10 is mounted on a mounting substrate.This is a perspective view of the package according to Embodiment 11.This is a bottom view of the package according to Embodiment 11.This is a side view showing an example of how the electronic device according to Embodiment 11 is mounted on a mounting substrate. Optical elements tend to generate heat, therefore, further improvements in heat dissipation are desired. According to one aspect of this disclosure, heat dissipation can be improved. [Embodiment 1] Hereinafter, an optical element housing package, electronic device, and electronic module according to one embodiment of the present disclosure will be described in detail with reference to the drawings. However, for the sake of convenience of explanation, the drawings referenced below may show only the components necessary for describing the embodiment in a simplified manner. Therefore, the substrate, element housing package, and electronic device according to each embodiment may include any components not shown in the drawings referenced. Also, please note that the dimensions of the components in each drawing do not faithfully represent the dimensions of the actual components and the dimensional ratios of each component. In this specification, the term "planar" means that it is not a curved surface at a visible level, or that it does not have visible irregularities, and does not require that it be strictly flat. The distinction between "upper" and "lower" in the following description is for convenience only and does not limit the actual orientation of the optical element housing package, electronic device, and electronic module when they are used. In this specification, the surface on which the element is mounted on the metal plate of the optical element housing package is defined as the upper surface. In the accompanying drawings, the X-Y plane is a plane parallel to the upper or lower surface of the metal plate, and the Z-ax