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WO-2026094630-A1 - SEMICONDUCTOR MODULE AND SEMICONDUCTOR DEVICE

WO2026094630A1WO 2026094630 A1WO2026094630 A1WO 2026094630A1WO-2026094630-A1

Abstract

This semiconductor module (1) comprises: a module substrate (10) that has a first surface (10A), and a second surface (10B) that is on the opposite side from the first surface (10A); a first electronic component group (21) that is mounted on an outer peripheral portion of the first surface (10A); and an external output electrode group (20) for mounting the module substrate (10) on an external substrate (30), the external output electrode group (20) being disposed on the first surface (10A) closer to the central portion of the module substrate (10) than the outer peripheral portion on which the first electronic component group (21) is mounted.

Inventors

  • NARITA TETSUYA

Assignees

  • 株式会社村田製作所

Dates

Publication Date
20260507
Application Date
20251015
Priority Date
20241028

Claims (10)

  1. A module substrate having a first surface and a second surface which is the opposite surface of the first surface, The first group of electronic components mounted on the outer periphery of the first surface, An external output electrode group for mounting the module substrate onto an external substrate, wherein the external output electrode group is located on the first surface, closer to the center of the module substrate than the outer periphery on which the first group of electronic components is mounted, Equipped with, Semiconductor module.
  2. The semiconductor module according to claim 1, wherein the external output electrode group is arranged in a frame shape on the first surface of the module substrate.
  3. The module substrate further comprises semiconductor components mounted in the central part of the first surface, The semiconductor module according to claim 1 or 2, wherein the group of external output electrodes is arranged on the first surface between the central portion on which the semiconductor components are mounted and the outer peripheral portion on which the first group of electronic components are mounted.
  4. The distance L1 between the semiconductor component and the external output electrode group and the distance L2 between adjacent external output electrodes in the external output electrode group are, L1 ≥ L2 The semiconductor module according to claim 3, having the relationship described above.
  5. The semiconductor module according to any one of claims 1 to 4, further comprising a second group of electronic components mounted on the second surface of the module substrate.
  6. The aforementioned module substrate is rectangular in shape. The semiconductor module according to any one of claims 1 to 5, wherein both the first group of electronic components and the group of external output electrodes are arranged to avoid the corner portions on the first surface of the module substrate.
  7. The semiconductor module according to claim 6, further comprising a dummy electrode disposed at the corner portion of the first surface of the module substrate.
  8. The semiconductor module according to claim 7, wherein the dummy electrode is larger than any of the external output electrodes in the external output electrode group.
  9. The semiconductor module according to any one of claims 1 to 8, wherein the second surface of the module substrate is sealed by a metal cover member.
  10. A semiconductor module according to any one of claims 1 to 9, The external substrate and, Equipped with, A semiconductor device in which the group of external output electrodes of the semiconductor module is soldered to the external substrate.

Description

Semiconductor modules and semiconductor devices This invention relates to semiconductor modules and semiconductor devices. To increase the capacity and functionality of semiconductor devices, semiconductor modules with increased integration density have been put into practical use. These modules are created by mounting electronic components on both sides of a wiring board, molding them with resin, and integrating them into a single package. For example, Patent Document 1 discloses a semiconductor module packaged in a BGA (Ball Grid Array) type, in which a semiconductor chip is mounted in the central region of one side of a wiring board, a group of conductor post pins is arranged on the outermost periphery of that side, and solder balls, which serve as external terminals, are mounted on the surface of these conductor post pins exposed from the surface of the molded resin. This is a plan view of the first surface of a semiconductor module according to the first embodiment.This is a cross-sectional view of the semiconductor module according to the first embodiment, along the line II-II.This is a plan view of the second surface of a semiconductor module according to the first embodiment.This is a cross-sectional view of a semiconductor device in which a semiconductor module according to the first embodiment is bonded to an external substrate.This is a cross-sectional view of the semiconductor module according to the first embodiment when the second surface is sealed with a top cover.This is a plan view of the first surface of a semiconductor module according to the second embodiment.This is a plan view of the first surface of a semiconductor module according to a modified example of the second embodiment. The embodiments of the present invention will be described below with reference to the drawings. The drawings of this embodiment are illustrative, and the dimensions and shapes of the parts are schematic; therefore, the technical scope of the present invention should not be limited to these embodiments. <First Embodiment> First, the configuration of the semiconductor module 1 according to the first embodiment of the present invention will be described with reference to Figures 1 to 5. Each drawing may be accompanied by a Cartesian coordinate system consisting of the X, Y, and Z axes for convenience, in order to clarify the relationships between the drawings and to help understand the positional relationships of each component. The directions parallel to the X, Y, and Z axes are referred to as the X-axis direction, Y-axis direction, and Z-axis direction, respectively. The plane defined by the X and Y axes is referred to as the XY plane (the same applies to other planes). For convenience, the positive Z-axis direction (direction of the arrow) will be described as up or upward, and the negative Z-axis direction (opposite direction of the arrow) will be described as down or downward, but the orientation of the semiconductor module 1 is not limited to these. Figure 1 is a plan view of the semiconductor module 1 according to the first embodiment, viewed from the first surface (downward in the Z-axis direction). Figure 2 is a cross-sectional view of the semiconductor module 1 according to the first embodiment. Figure 3 is a plan view of the semiconductor module 1 viewed from the second surface (upward in the Z-axis direction). Figure 4 is a cross-sectional view of a semiconductor device in which the semiconductor module according to the first embodiment is bonded to an external substrate 30. Note that the resin mold portion and wires are omitted from the illustration in Figures 1, 3, 6, and 7. The semiconductor module 1 comprises a module substrate 10, a plurality of external output electrode groups 20 arranged on the first surface 10A, a plurality of electronic component groups 21 mounted on the outer periphery of the first surface 10A, and a semiconductor component 22 mounted on the central part of the first surface. Here, the central part on which the semiconductor component 22 is mounted includes the center of the first surface and does not necessarily refer only to the position where the center of the first surface 10A and the center of the semiconductor component 22 overlap in the XY plane. Furthermore, the outer periphery on which the electronic component groups 21 are mounted refers to the area of the first surface 10A excluding the central part. The outer periphery on which the electronic component groups 21 are mounted may be an area with a predetermined width from the outer edge of the first surface 10A, or it may be an area with a predetermined width from inside the outer edge of the first surface 10A. The module substrate 10 comprises a first surface 10A and a second surface 10B, which are opposing main surfaces. The first surface 10A is the bottom surface, and the second surface 10B is the top surface. The material of the module substrate 10 is not particularly limited; for example, it may be a composit