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WO-2026094665-A1 - SUBSTRATE PROCESSING APPARATUS, FLUID SUPPLY SYSTEM, AND SUBSTRATE PROCESSING METHOD

WO2026094665A1WO 2026094665 A1WO2026094665 A1WO 2026094665A1WO-2026094665-A1

Abstract

A substrate processing apparatus according to one aspect of the present disclosure performs processing for drying a substrate by replacing a liquid film of a drying liquid formed on the substrate with a processing fluid in a supercritical state, and comprises a processing container and a fluid supply unit that supplies the processing fluid into the processing container. The fluid supply unit has a plurality of first supply lines connected in parallel and a second supply line that connects the plurality of first supply lines and the processing container. Each of the plurality of first supply lines is provided with a heater and an on-off valve in order from the upstream side of the flow of the processing fluid, and the second supply line is provided with a filter that captures particles contained in the processing fluid.

Inventors

  • HAYASHIDA, TAKAHIRO
  • SHIMOMURA, SHINICHIRO

Assignees

  • 東京エレクトロン株式会社

Dates

Publication Date
20260507
Application Date
20251017
Priority Date
20241031

Claims (9)

  1. A substrate processing apparatus that performs a process of drying a substrate by replacing the liquid film of a drying solution formed on the substrate with a processing fluid in a supercritical state, Processing container and A fluid supply unit that supplies processing fluid into the processing container, Equipped with, The aforementioned fluid supply unit is Multiple first supply lines connected in parallel, A second supply line connecting the multiple first supply lines and the processing container, It has, Each of the multiple first supply lines is provided with a heater and an on/off valve in order from the upstream side of the flow of the processing fluid. The second supply line is provided with a filter for collecting particles contained in the processing fluid. Circuit board processing equipment.
  2. The system includes a control circuit for controlling the fluid supply unit, The control circuit controls the heater such that the temperature of the processing fluid supplied from each of the plurality of first supply lines to the second supply line is different from that of the others. The substrate processing apparatus according to claim 1.
  3. The system includes a control circuit for controlling the fluid supply unit, The fluid supply unit has a temperature sensor located downstream of the filter in the second supply line. The control circuit controls the heaters provided in each of the plurality of first supply lines so that the temperature detected by the temperature sensor is maintained at or above the critical temperature of the processing fluid. The substrate processing apparatus according to claim 1.
  4. The system includes a control circuit for controlling the fluid supply unit, The fluid supply unit has a line heater for heating the second supply line, The control circuit performs control to set the set temperature of the line heater to a temperature higher than the set temperature of the heater with the lowest set temperature among the heaters provided in each of the plurality of first supply lines. The substrate processing apparatus according to claim 1.
  5. The system includes a control circuit for controlling the fluid supply unit, Multiple of the first supply lines are A low-temperature line that supplies the processing fluid heated to a first temperature to the second supply line, A high-temperature line supplies the processing fluid, which has been heated to a second temperature higher than the first temperature, to the second supply line. It has, The aforementioned control circuit is When transitioning from a first state in which the processing fluid is supplied from the low-temperature line to the second supply line to a second state in which the processing fluid is supplied from the high-temperature line to the second supply line, control is performed to simultaneously supply the processing fluid from the low-temperature line and the high-temperature line to the second supply line. The substrate processing apparatus according to claim 1.
  6. The system includes a control circuit for controlling the fluid supply unit, The fluid supply unit has a third supply line that branches off from the second supply line downstream of the filter and is connected to the processing container. The aforementioned control circuit is When supplying the processing fluid into the processing container without discharging the processing fluid from the processing container, control is performed to supply the processing fluid into the processing container from the third supply line. When simultaneously supplying the processing fluid into the processing container and discharging the processing fluid from the processing container, control is performed to supply the processing fluid from the second supply line into the processing container. The substrate processing apparatus according to claim 1.
  7. The system includes a control circuit for controlling the fluid supply unit, The fluid supply unit has a fourth supply line connected to the second supply line upstream of the filter, which supplies an inert gas to the second supply line. The control circuit controls the supply of the inert gas from the fourth supply line to the second supply line between the processing of one substrate and the processing of the next substrate. The substrate processing apparatus according to claim 1.
  8. A fluid supply system for supplying a supercritical processing fluid into a processing container, Multiple first supply lines connected in parallel, A second supply line connecting the multiple first supply lines and the processing container, It has, Each of the multiple first supply lines is provided with a heater and an on/off valve in order from the upstream side of the flow of the processing fluid. The second supply line is provided with a filter for collecting particles contained in the processing fluid. Fluid supply system.
  9. The substrate is dried by replacing the liquid film with the processing fluid in the processing container using the substrate processing apparatus according to any one of claims 1 to 7. Substrate processing method.

Description

Substrate processing apparatus, fluid supply system, and substrate processing method This disclosure relates to a substrate processing apparatus, a fluid supply system, and a substrate processing method. A technique for drying substrates using supercritical fluids is known. Patent Document 1 discloses a configuration for switching the temperature of the supercritical fluid supplied to the substrate. Figure 1 shows a substrate processing apparatus according to an embodiment of the present invention.Figure 2 is a flowchart showing the substrate processing method according to the embodiment.Figure 3 shows the pressure change inside the processing vessel in the substrate processing method according to the embodiment.Figure 4 is a diagram (1) showing a substrate processing method according to an embodiment.Figure 5 is a diagram (2) showing a substrate processing method according to an embodiment.Figure 6 shows a substrate processing apparatus according to the first modified example.Figure 7 shows a substrate processing apparatus according to a second modified example. The following describes exemplary embodiments of this disclosure, not limited to those described herein, with reference to the attached drawings. In all attached drawings, identical or corresponding members or components are denoted by the same or corresponding reference numerals, and redundant descriptions are omitted. [Substrate Processing Equipment] Referring to Figure 1, the substrate processing apparatus 10 according to the embodiment will be described. Figure 1 is a diagram showing the substrate processing apparatus 10 according to the embodiment. The substrate processing apparatus 10 is a device that dries a substrate W by replacing the liquid film of the drying solution formed on the substrate W with a supercritical processing fluid. The substrate processing apparatus 10 includes a processing unit 11, a fluid supply unit 12, a discharge unit 13, and a control circuit 14. The processing unit 11 comprises a processing container 111 and a holding unit 112. The processing container 111 is a container with a processing space formed inside that can accommodate, for example, a substrate W with a diameter of 300 mm. The substrate W is, for example, a semiconductor wafer. The holding unit 112 is provided inside the processing container 111. The holding unit 112 holds the substrate W horizontally. The holding unit 112 is, for example, integrally configured with the processing container 111. The holding unit 112 may also be a holding plate configured separately from the processing container 111. The processing unit 11 includes a pressure sensor P10 for detecting the pressure inside the processing container 111. The fluid supply unit 12 includes a processing fluid supply source S11, first supply lines L11a and L11b, and a second supply line L12. The processing fluid supply source S11 is a source of processing fluid. The processing fluid may be, for example, liquid carbon dioxide ( CO₂ ). The first supply line L11a is connected upstream to the processing fluid supply source S11 and downstream to the second supply line L12. The first supply line L11a is equipped with a heater HE11a, a temperature sensor T11a, and an on-off valve V11a, in that order from upstream. The heater HE11a heats the processing fluid supplied from the processing fluid supply source S11 to a first temperature and supplies the fluid at the first temperature downstream. The first temperature is between 40°C and 100°C, for example, 60°C. Because the first temperature is relatively low, the first supply line L11a is also called a low-temperature line. The heater HE11a includes, for example, a cast-in heater. The heater HE11a may also include a tank with a heater embedded in the wall, etc. The temperature sensor T11a detects the temperature of the processing fluid flowing through the first supply line L11a. The on-off valve V11a is a valve that switches the flow of the processed fluid on and off. When the on-off valve V11a is open, it allows the processed fluid to flow into the downstream second supply line L12; when it is closed, it does not allow the processed fluid to flow into the downstream second supply line L12. A line heater LH11a is provided downstream of the heater HE11a in the first supply line L11a. The line heater LH11a heats the first supply line L11a downstream of the heater HE11a. This suppresses the temperature drop of the processing fluid flowing through the first supply line L11a. The first supply line L11b is connected in parallel with the first supply line L11a. The upstream end of the first supply line L11b is connected to the processing fluid supply source S11, and the downstream end is connected to the second supply line L12. The first supply line L11b is equipped with a heater HE11b, a temperature sensor T11b, and an on-off valve V11b, in that order from upstream. The heater HE11b heats the processing fluid supplied from the processing fluid supply source S11 to