WO-2026094933-A1 - ELECTRODE OF PRINTED CIRCUIT BOARD AND METHOD FOR FORMING ELECTRODE OF PRINTED CIRCUIT BOARD

WO2026094933A1WO 2026094933 A1WO2026094933 A1WO 2026094933A1WO-2026094933-A1

Abstract

[Problem] The purpose of the present invention is to provide: an electrode of a printed circuit board for improving the yield of soldering of the printed circuit board; and a method for forming the electrode of the printed circuit board. [Solution] An electrode (1) of a printed circuit board is provided with a region (3) and a region (5) on the surface thereof. The region 3 and the region 5 have different solder wettability.

Inventors

SHIMIZU TATSUO

Assignees

清水技研株式会社

Dates

Publication Date: 20260507
Application Date: 20251028
Priority Date: 20241029

Claims (7)

Electrodes on a printed circuit board, The surface of the electrode comprises a first region and a second region. The first region and the second region are electrodes of a printed circuit board with different solder wettability.
The surface of the electrode comprises a third region, The electrode of the printed circuit board according to claim 1, wherein the third region has a recess for trapping solder.
The electrode of the printed circuit board according to claim 2, wherein the third region is the region surrounding the first region.
The first region is a region with higher solder wettability than the second region. The electrode of the printed circuit board according to claim 1, wherein the second region is a region surrounding the first region.
The first region has an uneven pattern formed on its surface. The aforementioned uneven pattern is formed by laser processing, and is an electrode for a printed circuit board according to claim 4.
The electrode is constructed by laminating multiple metals with different wettability. The electrode of the printed circuit board according to claim 1, wherein the first region and the second region are made of different metals.
The first region and the second region are made of the same metal. The electrode of the printed circuit board according to claim 1, wherein the first region and the second region have different degrees of oxidation.

Description

Electrodes for printed circuit boards and methods for forming electrodes for printed circuit boards This invention relates to electrodes for printed circuit boards and methods for forming electrodes for printed circuit boards. Traditionally, a challenge in soldering printed circuit boards (PCBs) has been the need to minimize soldering defects. In particular, in applications requiring high reliability, the occurrence of defects such as voids, balls, and bridges in PCB soldering (yield) is a significant problem. Furthermore, even beyond these specific applications, various technologies have been developed to improve soldering quality and prevent defects in PCB soldering. (Patent Documents 1 and 2). This is a schematic diagram illustrating the electrode 1 of a printed circuit board according to the first embodiment of the present invention.This is a schematic diagram illustrating the electrode 1 of a printed circuit board according to the first embodiment of the present invention.This is a schematic diagram illustrating the electrode 1 of a printed circuit board according to the first embodiment of the present invention.This is a schematic diagram illustrating the electrode 1 of a printed circuit board according to the first embodiment of the present invention.This is a schematic diagram illustrating the electrode 10 of a printed circuit board according to a second embodiment of the present invention.This is a schematic diagram illustrating the electrode 10 of a printed circuit board according to a second embodiment of the present invention.This is a flowchart illustrating a method for forming electrodes 1 on a printed circuit board according to a first embodiment of the present invention.This is a flowchart illustrating another method for forming electrodes 1 on a printed circuit board according to the first embodiment of the present invention.This is a flowchart illustrating a method for forming electrodes 10 on a printed circuit board according to a second embodiment of the present invention.This is a flowchart illustrating another method for forming electrodes 10 on a printed circuit board according to a second embodiment of the present invention.This is a schematic diagram illustrating the electrode 20 of a printed circuit board according to a third embodiment of the present invention.This is a schematic diagram illustrating an experimental example of electrode 1 of a printed circuit board according to the first embodiment of the present invention.This is a photograph serving as a substitute for a drawing illustrating an experimental example of electrode 1 of a printed circuit board according to the first embodiment of the present invention.This is a photograph (X-ray) used as a substitute for a drawing to illustrate an experimental example of electrode 1 of a printed circuit board according to the first embodiment of the present invention.This is a photograph (X-ray) that serves as a substitute for a drawing to illustrate Comparative Example 1 of an experimental example of electrode 1 of a printed circuit board according to the first embodiment of the present invention.This is a photograph (X-ray) that serves as a substitute for a drawing to illustrate Comparative Example 2 of an experimental example of electrode 1 of a printed circuit board according to the first embodiment of the present invention. The electrodes 1 and 10 of the printed circuit board and the method for forming the electrodes 1 and 10 of the printed circuit board according to embodiments of the present invention will be explained below with reference to Figures 1 to 14. Note that in all the following drawings, the dimensions and proportions of each component may be shown differently as appropriate for ease of understanding. Figure 1 is a schematic front view of electrode 1 of a printed circuit board according to the first embodiment of the present invention. As shown in Figure 1, electrode 1 of the printed circuit board according to the first embodiment of the present invention comprises region 3 and region 5. Figure 2 shows a schematic front view of the printed circuit board electrode 1 with a ball-shaped solder placed on it (upper figure), and a schematic side view (lower figure). The ball-shaped solder is placed in region 3 of electrode 1. The ball-shaped solder is placed on the upper surface of region 3 of electrode 1. Region 3 of electrode 1 has the uneven pattern shown in Figure 3 formed on its entire surface. The upper figure of Figure 3 is an enlarged front view of region 3 of electrode 1, and the lower figure of Figure 3 is an enlarged side view of region 3 of electrode 1. As shown in Figure 3, region 3 of electrode 1 has a surface in which the pattern of convex 3a and concave 3b is repeated. Region 3 of electrode 1 should have a surface pattern in which the contact angle between the solder and the electrode is reduced due to the uneven shape, thereby increasing the wettability of the solder. The side length of one convex 3a or