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WO-2026095093-A1 - HEADPHONE DEVICE HAVING ANTENNA MODULE

WO2026095093A1WO 2026095093 A1WO2026095093 A1WO 2026095093A1WO-2026095093-A1

Abstract

This antenna module comprises: a dielectric formed in a hexahedral shape; a metal patch disposed on a first surface of the dielectric; a PCB disposed on a second surface of the dielectric; a ground region formed on the second surface of the dielectric or the PCB in correspondence to a region in which the metal patch is formed; an inner slot including a first slot formed in a first length in a first axial direction of the metal patch, and a second slot and a third slot formed in a second length in a second axial direction from end portions of the first slot; and an outer slot having a feeding point formed on the metal patch in an inner region of the inner slot, and including a fourth slot formed in a third length in the first axial direction so as to surround the inner slot, and a fifth slot and a sixth slot formed in a fourth length in the second axial direction from end portions of the fourth slot.

Inventors

  • KIM, Duckyun
  • LEE, Byongyol
  • LEE, SANGHEON
  • LEE, Jeonghong

Assignees

  • 엘지전자 주식회사

Dates

Publication Date
20260507
Application Date
20241029

Claims (20)

  1. In headphone devices, Headband; A first headphone unit connected to one end of the headband; A second headphone unit electrically connected to the first headphone unit through the headband and connected to the other end of the headband; A first PCB disposed inside the first headphone unit; A second PCB disposed inside the second headphone unit; A first antenna module configured to receive a wireless signal and disposed in a first area of the first PCB; and It includes a second antenna module configured to receive the wireless signal by being disposed in the second area of the second PCB corresponding to the first area, and The above-mentioned first antenna module is, A genome formed as a cuboid; A metal patch disposed on the first surface of the above dielectric; A ground area formed on the second surface of the dielectric or on the first PCB corresponding to the area where the metal patch is formed - the ground area has a slot area formed so that a signal line is disposed therein; An internal slot comprising a first slot formed with a first length in the first axial direction of the metal patch, a second slot formed with a second length in the second axial direction at the ends of the first slot, and a third slot; and A feeding point is formed in the metal patch, which is the internal region of the internal slot, and It includes an external slot comprising a fourth slot formed with a third length in the first axial direction to surround the internal slot, a fifth slot formed with a fourth length in the second axial direction at the ends of the fourth slot, and a sixth slot. A first point between the first side in the second axial direction of the metal patch and the outer side of the fifth slot is connected to a second point of the ground area, and A third point between the second side in the second axial direction of the metal patch and the outer edge of the sixth slot is connected to a fourth point of the ground area, and The second axis direction is formed orthogonally to the first axis direction, and The third length of the fourth slot of the above external slot is formed to be longer than the first length of the first slot of the above internal slot, and A headphone device in which the fourth length of the fifth slot and the sixth slot of the external slot is formed to be longer than the second length of the second slot and the third slot of the internal slot.
  2. In Article 10, The first antenna module is disposed in a first area of the first PCB, and The second antenna module includes the metal patch, the ground region, the inner slot, and the outer slot, and A headphone device in which the second antenna module is disposed in the second area of the second PCB corresponding to the first area of the first PCB.
  3. In Article 1, The first antenna module and the second antenna module are configured to receive wireless signals in the UWB frequency band, and A third antenna module configured to receive a wireless signal in the Bluetooth (BT) frequency band in the third area of the first PCB; A cable housed inside the headband and formed to electrically connect the first PCB and the second PCB; A switch disposed in a fourth region between the first region and the third region of the first PCB and configured to connect the end of the cable and the first antenna module; and A headphone device comprising a processor operably coupled to the above switch and the above third antenna module.
  4. In Paragraph 3, The above processor is, Sound source data and dummy data are received respectively through the first antenna module and the second antenna module, and When the sound source data is received by the first antenna module, the system controls the sound source data to be played, and If the RSSI value of the sound source data received by the first antenna module is higher than the RSSI value of the dummy data received by the second antenna module, the next data received through the first antenna module is received as sound source data, and the dummy data is received through the second antenna module. A headphone device that controls the reception of sound source data through the second antenna module and the reception of dummy data through the first antenna module when the sound source data is not received through the first antenna module.
  5. In Paragraph 4, The above processor is, If the sound source data is not received by the second antenna module, control is made so that the sound source data is received through the first antenna module. When the sound source data is received by the second antenna module, control is made to play the sound source data. If the RSSI value of the sound source data received by the second antenna module is higher than the RSSI value of the dummy data received by the first antenna module, the next data received through the second antenna module is received as sound source data, and the dummy data is received through the first antenna module. A headphone device that controls the reception of sound source data through the first antenna module and the reception of dummy data through the second antenna module when the sound source data is not received through the second antenna module.
  6. In Article 1, The above-mentioned first antenna module is, A feed via formed to connect the feed point of the metal patch and a connection point adjacent to one end of the feed line; A first ground via formed to connect the first point of the metal patch and the second point of the ground region; and A headphone device comprising a second ground via formed to connect the third point of the metal patch and the fourth point of the ground area.
  7. In Article 6, The above feed via is formed to vertically connect the metal patch where the feed point is located and the ground area where the connection point is located, and The first ground via is formed to vertically connect the metal patch on which the first point is located and the ground area on which the second point is located, and A headphone device, wherein the second ground via is formed to vertically connect the metal patch on which the third point is located and the ground area on which the fourth point is located.
  8. In Article 6, The above dielectric includes a substrate disposed on a second surface of the above dielectric, and The ground region is disposed on the second surface of the substrate corresponding to the region where the metal patch is formed, and A headphone device in which the feed line is formed on the second surface of the dielectric or the first surface of the substrate.
  9. In Article 8, The above-mentioned feed via is connected to the above-mentioned feed line to form a feed structure, and The above power supply structure is, The feed via formed to vertically connect the feed point of the metal patch and the connection point of the feed line; The feed line formed to be connected to the feed via at one end; The signal line formed on the second surface of the substrate; and A headphone device comprising a connecting via formed to vertically connect the other end of the feed line and the signal line.
  10. In Paragraph 3, The first antenna module and the second antenna module are configured to resonate in a first frequency band of 5.0 to 8.5 GHz and a second frequency band of 8.5 to 10.6 GHz for UWB wireless communication, and A headphone device in which the length of the above external slot is formed within a predetermined range based on a wavelength corresponding to 9 GHz within the second frequency band.
  11. In Article 10, The length of the above metal patch is formed within a predetermined range based on 12mm, and The third length of the first slot forming the external slot is formed within a predetermined range based on 6mm, and A headphone device in which the fourth length of the second slot and the third slot forming the external slot is formed within a predetermined range based on 8mm.
  12. In Article 10, The metal patch of the first antenna module is placed on the first surface of the first PCB in the first area where the first ground area is removed, and The metal patch of the second antenna module is placed on the first surface of the second PCB in the second region where the second ground region is removed, and One end of the metal patch of the first antenna module is positioned adjacent to the boundary of the first PCB compared to the other end, and A headphone device in which one end of the metal patch of the second antenna module is positioned adjacent to the boundary of the second PCB compared to the other end.
  13. In Article 12, The metal patch of the first antenna module is offset from the center of the first PCB toward the lower boundary side in the second axis direction, and The second antenna module is positioned offset from the center of the second PCB in the direction of the first axis, and A headphone device wherein the third antenna module is offset from the center of the first PCB toward the upper boundary side in the direction of the second axis.
  14. In an antenna module placed in a headphone device, A genome formed as a cuboid; A metal patch disposed on the first surface of the above dielectric; A PCB disposed on the second surface of the above dielectric; A ground area formed on the second surface of the dielectric or on the PCB corresponding to the area where the metal patch is formed - the ground area has a slot area formed therein for placing a signal line; An internal slot comprising a first slot formed with a first length in the first axial direction of the metal patch, a second slot formed with a second length in the second axial direction at the ends of the first slot, and a third slot; and A feeding point is formed on the metal patch in the inner region of the inner slot, and It includes an external slot comprising a fourth slot formed with a third length in the first axial direction to surround the internal slot, a fifth slot formed with a fourth length in the second axial direction at the ends of the fourth slot, and a sixth slot. A first point between the first side in the second axial direction of the metal patch and the outer side of the fifth slot is connected to a second point of the ground area, and A third point between the second side in the second axial direction of the metal patch and the outer edge of the sixth slot is connected to a fourth point of the ground area, and The second axis direction is formed orthogonally to the first axis direction, and The third length of the fourth slot of the above external slot is formed to be longer than the first length of the first slot of the above internal slot, and An antenna module in which the fourth length of the fifth slot and the sixth slot of the external slot is formed to be longer than the second length of the second slot and the third slot of the internal slot.
  15. In Article 14, The above internal slot is formed into a first U-shape in which the metal pattern of the metal patch is removed so that the first dielectric region is exposed on the left, right, and bottom, and The above external slot is an antenna module in which the metal pattern of the metal patch is removed so that a second dielectric region is formed in a second U-shape on the left, right, and top.
  16. In Article 15, A feed via formed to connect the feed point of the metal patch and a connection point adjacent to one end of the feed line; A first ground via formed to connect the first point of the metal patch and the second point of the ground region; and An antenna module comprising a second ground via formed to connect the third point of the metal patch and the fourth point of the ground area.
  17. In Article 16, The above feed via is formed to vertically connect the metal patch where the feed point is located and the ground area where the connection point is located, and The first ground via is formed to vertically connect the metal patch on which the first point is located and the ground area on which the second point is located, and An antenna module, wherein the second ground via is formed to vertically connect the metal patch on which the third point is located and the ground area on which the fourth point is located.
  18. In Article 16, The above dielectric includes a substrate disposed on a second surface of the above dielectric, and The ground region is disposed on the second surface of the substrate corresponding to the region where the metal patch is formed, and An antenna module in which the feed line is formed on the second surface of the dielectric or the first surface of the substrate.
  19. In Article 18, The above-mentioned feed via is connected to the above-mentioned feed line to form a feed structure, and The above power supply structure is, The feed via formed to vertically connect the feed point of the metal patch and the connection point of the feed line; The feed line formed to be connected to the feed via at one end; The signal line formed on the second surface of the substrate; and An antenna module comprising a connecting via formed to vertically connect the other end of the feed line and the signal line.
  20. In Article 14, The above antenna module is configured to resonate in a first frequency band of 5.0 to 8.5 GHz and a second frequency band of 8.5 to 10.6 GHz for UWB wireless communication, and An antenna module in which the length of the above external slot is formed within a predetermined range based on a wavelength corresponding to 9 GHz within the second frequency band.

Description

headphone device equipped with an antenna module This specification relates to a headphone device having an antenna module, and more specifically, to a broadband operating antenna module and a headphone device having the same. Electronic devices, such as electronic accessories for mobile phones, computers, and other electronic equipment, may include wireless circuits. For example, speakers, headphones, or earphones may be used as electronic devices that communicate wirelessly with mobile phones and other equipment. In this regard, speakers, headphones, or earphones may be used for sound output. The headphone device may be worn by placing a headband portion over the user's head and completely covering the user's ears. The headphone device can reduce external noise by primarily shielding it. By shielding it from external noise, the headphone device can provide the user with an experience that allows them to focus on the music. The headphone device can output sound by connecting to a user terminal wirelessly or via a wire. Headphone devices can transmit and receive audio signals by wirelessly connecting to electronic devices such as computers or smartphones using Bluetooth (BT). However, there is a problem in that it is difficult to transmit high-quality music due to the narrow bandwidth when transmitting and receiving audio signals using Bluetooth (BT). In addition, high latency causes the audio signal to be transmitted later than the screen, and this high latency can be a problem, especially in real-time games. To address these issues, wireless signal transmission and reception between headphone devices and electronic devices can be achieved by utilizing the wide-band UWB (ultra-wide band) frequency range. However, when using UWB with its wide bandwidth, wireless radiation performance may be degraded due to its higher frequency characteristics and lower transmission power compared to Bluetooth. FIG. 1 is a configuration diagram of an exemplary system including an electronic device that communicates wirelessly with a headphone device according to the present specification. Figure 2 shows the internal structure of a headphone device in which an antenna module operating in the Bluetooth frequency band is placed. Figure 3 shows the omnidirectional radiation pattern of the antenna module and the structure placed on the PCB. Figure 4 shows the radiation pattern and VSWR when a user wears a headphone device with an antenna module supporting UWB wireless communication placed in the headphone device. Fig. 5 is a plan view of the PCB on which the antenna module is placed and an enlarged view of the antenna module. Figure 6 shows an exploded view of the structure in which the metal patch and ground area of the antenna module of Figure 5 are connected to feed vias and ground vias. Figure 7 shows a perspective view of an antenna module in which a metal patch of the antenna module of Figure 5 is formed on the front surface of the dielectric. Figure 8 shows the top view, side view, and voltage standing wave ratio of an antenna module placed on a PCB. Figures 9 and 10 compare the current distribution, radiation pattern, and VSWR depending on the presence or absence of ground vias on the surface of a metal patch. Figure 11 shows radiation patterns according to antenna structures. Figure 12 shows radiation patterns radiated through a headphone device in which the antenna structures of Figure 11 are arranged. FIG. 13 is an enlarged view of PCBs in which antenna modules are arranged inside a headphone device according to the present specification. Figure 14 shows a diagram of PCBs and electronic components arranged in the headphone device of Figure y1. FIG. 15 shows a block diagram in which the first and second antenna modules are connected to the processor through a switch and a cable. FIG. 16 is a conceptual diagram showing wireless communication performance with an electronic device according to the radiation pattern of a headphone device in which an antenna module is placed internally. FIG. 17 shows a flowchart of a control method performed by a processor that selects one of the first and second antenna modules of a headphone device according to the present specification. FIG. 18 shows a block diagram in which the first and second antenna modules are connected through a switch and a processor. Hereinafter, embodiments disclosed in this specification will be described in detail with reference to the attached drawings. Identical or similar components regardless of drawing symbols will be assigned the same reference number, and redundant descriptions thereof will be omitted. The suffixes "module" and "part" used for components in the following description are assigned or used interchangeably solely for the ease of drafting the specification and do not inherently possess distinct meanings or roles. Furthermore, in describing embodiments disclosed in this specification, if it is determined that a detailed description of related