WO-2026095320-A1 - MULTILAYER CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND ELECTRONIC DEVICE INCLUDING MULTILAYER CIRCUIT BOARD

WO2026095320A1WO 2026095320 A1WO2026095320 A1WO 2026095320A1WO-2026095320-A1

Abstract

A multilayer circuit board, a manufacturing method thereof, and an electronic device including the multilayer circuit board are provided, wherein the multilayer circuit board can reduce the number of processes and manufacturing costs by using a single-sided FCCL and RCC. The multilayer circuit board comprises: a core layer; a second circuit layer formed on a first surface of the core layer; a first interlayer insulating layer covering the second circuit layer; a first circuit layer formed on the first interlayer insulating layer; a second interlayer insulating layer formed on a second surface of the core layer; and a third circuit layer formed on the second interlayer insulating layer.

Inventors

SON, DONG EUN
PARK, HYO JIN
LEE, JUNG SHIK

Assignees

스템코 주식회사

Dates

Publication Date: 20260507
Application Date: 20250909
Priority Date: 20241029

Claims (19)

Core layer; A second circuit layer formed on the first surface of the core layer; A first interlayer insulating layer covering the second circuit layer; A first circuit layer formed on the first interlayer insulating layer; A second interlayer insulating layer formed on the second surface of the core layer; and A multilayer circuit board comprising a third circuit layer formed on the second interlayer insulating layer.
In Article 1, A multilayer circuit board further comprising an insulating portion provided between the first interlayer insulating layer and the first circuit layer, or between the second interlayer insulating layer and the third circuit layer.
In Article 1, A multilayer circuit board further comprising a fourth circuit layer formed on the second surface of the core layer.
In Article 1, A multilayer circuit board further comprising a seed layer provided between the first interlayer insulating layer and the first circuit layer, or between the second interlayer insulating layer and the third circuit layer.
In Article 1, A multilayer circuit board in which at least one of the first interlayer insulating layer and the second interlayer insulating layer is made of a material of a different type from the core layer.
In Article 1, A multilayer circuit board in which the thickness of the second interlayer insulating layer is equal to or thicker than the spacing distance between the first circuit layer and the second circuit layer.
In Article 1, A first via hole connecting the first circuit layer and the second circuit layer; and A multilayer circuit board further comprising a first circuit connection layer formed within the first via hole.
In Article 1, A second via hole connecting the second circuit layer and the third circuit layer; and A multilayer circuit board further comprising a second circuit connection layer formed within the second via hole.
In Article 7, The above first circuit connection layer is, First partial metal layer; and It includes a second partial metal layer surrounding the first partial metal layer, and The second partial metal layer is formed to fill the space surrounded by the first partial metal layer, or The above second partial metal layer is a multilayer circuit board formed integrally with the above first circuit layer.
In Article 7, The second circuit layer above includes a groove, and The first circuit connection layer is extended to fill the groove, and The above groove is a multilayer circuit board formed when removing a conductive layer formed on the surface of the second circuit layer.
In Article 2, A multilayer circuit board in which the insulating portion and the first metal layer serving as a base for forming the first circuit layer are integrally provided.
A step of forming a second circuit layer on the first surface of the core layer; A step of forming a first interlayer insulating layer and a first metal layer on the second circuit layer; A step of forming a first via hole that penetrates the first interlayer insulating layer and the first metal layer, while exposing at least a portion of the second circuit layer; A step of forming a first partial metal layer within the first via hole; A step of forming a second partial metal layer within the first via hole; and A method for manufacturing a multilayer circuit board comprising the step of forming a first circuit layer based on the first metal layer.
In Article 12, A step of forming a second interlayer insulating layer and a second metal layer on the second surface of the core layer; A step of forming a second via hole that penetrates the core layer, the second interlayer insulating layer, and the second metal layer, while exposing at least a portion of the second circuit layer; A step of forming the first partial metal layer within the second via hole; A step of forming the second partial metal layer within the second via hole; and A method for manufacturing a multilayer circuit board, further comprising the step of forming a third circuit layer based on the second metal layer.
In Article 12, A step of forming a fourth circuit layer on the second surface of the core layer; A step of forming a second interlayer insulating layer and a second metal layer on the fourth circuit layer; A step of forming a third via hole that penetrates the second interlayer insulating layer and the second metal layer, while exposing at least a portion of the fourth circuit layer; A step of forming the first partial metal layer within the third via hole; A step of forming the second partial metal layer within the third via hole; and A method for manufacturing a multilayer circuit board, further comprising the step of forming a third circuit layer based on the second metal layer.
In Article 12, An insulating portion is further included between the first interlayer insulating layer and the first metal layer, or A method for manufacturing a multilayer circuit board comprising a seed layer further comprising the first interlayer insulating layer and the first circuit layer.
In Article 13, The first circuit layer and the third circuit layer are formed simultaneously, or A method for manufacturing a multilayer circuit board in which the first circuit layer or the third circuit layer is simultaneously formed integrally with the second partial metal layer.
In Article 12, The step of forming the first partial metal layer is, A hole conduction step of forming a first partial metal layer on the surface of the first metal layer, the first via hole, and the second circuit layer; and A method for manufacturing a multilayer circuit board comprising a micro-etching step of etching a portion of the first metal layer and the second circuit layer to remove a first partial metal layer formed on the surface of the first metal layer and the second circuit layer.
In Article 17, The thickness of the first metal layer etched by the above micro-etching is 0.5㎛ or more and 3.0㎛ or less, and A method for manufacturing a multilayer circuit board in which the thickness of the first metal layer after the etching step is 0.1 μm or more and 2.0 μm or less.
A multilayer circuit board manufactured by the manufacturing method according to claim 12.

Description

A multilayer circuit board, a method for manufacturing the same, and an electronic device including the multilayer circuit board The present invention relates to a manufacturing method for efficiently producing a multilayer circuit board, a multilayer circuit board produced according to the manufacturing method, and an electronic device including the multilayer circuit board. In the case of manufacturing a three-layer circuit board, conventionally, a second circuit layer and a third circuit layer are formed on both sides of a base film, respectively, and then a first circuit layer is formed on the second circuit layer. However, according to this method, a through hole for electrically connecting the second circuit layer and the third circuit layer is formed first, and then a via hole for electrically connecting the first circuit layer and the second circuit layer is formed. Additionally, a protective film is attached to the third circuit layer before forming the first circuit layer, and the protective film is removed from the third circuit layer after forming the first circuit layer. As such, according to the conventional method, multiple processes must be performed to manufacture a three-layer circuit board, and the associated costs may increase. FIG. 1 is a first flowchart for explaining, step by step, a method for manufacturing a multilayer circuit board according to some embodiments of the present invention. FIG. 2 is a first example diagram for explaining the product structure at step S110 of the manufacturing method of a multilayer circuit board. Figure 3 is a second example diagram for explaining the product structure at step S110 of the manufacturing method of a multilayer circuit board. FIG. 4 is a first example diagram for explaining the product structure at step S120 of the manufacturing method of a multilayer circuit board. FIG. 5 is a second example diagram for explaining the product structure at step S120 of the manufacturing method of a multilayer circuit board. FIG. 6 is a first example diagram for explaining the product production method in step S120 of the manufacturing method of a multilayer circuit board. FIG. 7 is a second example diagram illustrating a product production method in step S120 of a method for manufacturing a multilayer circuit board. FIG. 8 is a third example diagram illustrating a product production method in step S120 of a method for manufacturing a multilayer circuit board. FIG. 9 is a third example diagram illustrating the product structure at step S120 of the manufacturing method of a multilayer circuit board. FIG. 10 is a fourth example diagram illustrating the product structure at step S120 of the manufacturing method of a multilayer circuit board. Figure 11 is an example diagram illustrating the product structure at step S130 of the manufacturing method of a multilayer circuit board. FIG. 12 is a first example diagram for explaining the product structure at step S140 of the manufacturing method of a multilayer circuit board. FIG. 13 is a second example diagram for explaining the product structure at step S140 of the manufacturing method of a multilayer circuit board. FIG. 14 is a third example diagram illustrating the product structure at step S140 of the manufacturing method of a multilayer circuit board. FIG. 15 is a fourth example diagram illustrating the product structure at step S140 of the manufacturing method of a multilayer circuit board. FIG. 16 is a first example diagram for explaining the product structure at step S150 of the manufacturing method of a multilayer circuit board. FIG. 17 is a second example diagram for explaining the product structure at step S150 of the manufacturing method of a multilayer circuit board. FIG. 18 is an example diagram illustrating the product structure at step S160 of the manufacturing method of a multilayer circuit board. FIG. 19 is a second flowchart for explaining, step by step, a method for manufacturing a multilayer circuit board according to some embodiments of the present invention. FIG. 20 is an example diagram illustrating a product production method in step S125 of a method for manufacturing a multilayer circuit board. FIG. 21 is a third flowchart for explaining, step by step, a method for manufacturing a multilayer circuit board according to some embodiments of the present invention. FIG. 22 is an example diagram illustrating the product structure at step S155 of the manufacturing method of a multilayer circuit board. Embodiments of the present invention will be described in detail below with reference to the attached drawings. Identical components in the drawings are denoted by the same reference numerals, and redundant descriptions thereof are omitted. The first direction (D1) and the second direction (D2) can form a two-dimensional plane. The first direction (D1) may be the X-axis direction and the second direction (D2) may be the Y-axis direction. The first direction (D1) may be the left-right direction and