WO-2026095378-A1 - MEMBER FOR MANUFACTURING THIN-FILM VAPOR CHAMBER AND METHOD FOR MANUFACTURING THIN-FILM VAPOR CHAMBER USING SAME

WO2026095378A1WO 2026095378 A1WO2026095378 A1WO 2026095378A1WO-2026095378-A1

Abstract

Disclosed are a member for manufacturing a thin-film vapor chamber and a method for manufacturing a vapor chamber using the same. According to an embodiment disclosed herein, a member for manufacturing a thin-film vapor chamber having an inner space is provided, the member comprising: a working fluid inlet part formed around a working fluid inlet port between a lower plate and an upper plate which are bonded to each other; a chamber part for forming a vapor chamber; and a channel part for connecting the working fluid inlet part and the chamber part to each other. The vapor chamber can be effectively manufactured if the chamber part filled with working fluid is sealed by bonding the middle of the channel part after injecting the working fluid into the member for manufacturing the thin-film vapor chamber.

Inventors

JANG, HYEON SUK
KIM, JONG SUN

Dates

Publication Date: 20260507
Application Date: 20250929
Priority Date: 20241029

Claims (13)

A lower plate in the form of a metal thin film including a working fluid inlet formed through the center of a set; and It includes an upper plate in the form of a metal thin film having a shape symmetric to the lower plate and having a vapor chamber on the bottom surface and a space groove for forming a path extending from the working fluid inlet to the vapor chamber, When the bottom surface of the upper plate is joined to the upper surface of the lower plate, an internal space is formed between the upper plate and the lower plate, the internal space comprising an operating fluid injection part formed around the operating fluid injection port by the space groove, a chamber part for forming the vapor chamber, and a channel part for connecting the operating fluid injection part and the chamber part to each other. A component for manufacturing a thin film vapor chamber.
In paragraph 1, The above-mentioned thin film vapor chamber manufacturing component is, A member for manufacturing a thin film vapor chamber, further comprising a mesh-type sheet interposed within the chamber portion and in close contact with the bottom surface of the upper plate and the upper surface of the lower plate.
In paragraph 1, The above space groove is, A member for manufacturing a thin film vapor chamber, formed by press-forming the upper plate, which is in the form of a single thin film.
In paragraph 1, The above working fluid injection unit is, A gate channel formed in the peripheral area of the above-mentioned working fluid inlet; An outer channel formed separately and spaced apart along the perimeter of the gate channel, with one side connected to the channel portion; and A member for manufacturing a thin film vapor chamber, comprising one or more connecting passages forming a connecting passage between the gate passage and the outer passage.
In paragraph 4, The above working fluid injection unit is, A member for manufacturing a thin film vapor chamber, wherein the bottom surface of the upper plate and the top surface of the lower plate are in close contact with each other between the gate channel and the outer channel, and a separation region is formed to spatially separate the gate channel and the outer channel.
In paragraph 5, The above gate channel is a circular space having an inner diameter larger than the diameter of the above working fluid inlet, and A member for manufacturing a thin film vapor chamber, wherein the above connecting channel is one or more spaces formed radially from the gate channel to the outer channel.
In paragraph 1, The above working fluid injection unit is, A member for manufacturing a thin film vapor chamber, having a length equal to the height of the working fluid injection part and including two or more support ribs formed at regular intervals along the inner circumference of the working fluid injection port in the direction inward of the working fluid injection part.
In paragraph 1, The above chamber part is, A plurality of first embos formed protruding downward on an inner surface corresponding to the bottom surface of the upper plate; and A member for manufacturing a thin film vapor chamber, comprising at least one of a plurality of second embos formed protruding upwardly on an inner surface corresponding to the bottom surface of the lower plate.
In paragraph 1, The above channel section is, A member for manufacturing a thin-film vapor chamber, wherein the lower plate and the upper plate are joined together to form a length between the chamber portion and the working fluid injection portion equal to the width of the area forming the outer edge of the chamber portion.
A method for manufacturing a thin film vapor chamber using a thin film vapor chamber manufacturing member according to any one of claims 1 to 9, A step of preparing a member for manufacturing a thin film vapor chamber by joining the upper edge of the lower plate and the lower edge of the upper plate together; A step of maintaining the internal space of the above-mentioned thin film vapor chamber manufacturing member in a vacuum state and injecting a working fluid into the internal space through the working fluid inlet port; A step of sealing the chamber portion filled with the working fluid by joining the interruption of the above channel portion; and A step of separating the working fluid injection part from the vapor chamber including the chamber part by cutting along a preset reference line perpendicular to the longitudinal direction of the channel part on the channel part. including Method for manufacturing a thin film vapor chamber.
In Paragraph 10, The step of sealing the chamber portion filled with the working fluid by joining the interruption of the channel portion is A step of forming a flat area by applying vertical pressure to the middle of the channel section so that the upper surface of the lower plate forming the inner surface of the middle of the channel section and the lower surface of the upper plate are in close contact vertically, thereby isolating the chamber section and the working fluid injection section from each other; and A method for manufacturing a thin film vapor chamber, comprising the step of welding the flat area so that the chamber portion is sealed.
In Paragraph 11, The step of forming a flat area by applying vertical pressure to the interruption of the channel section above is: A method for manufacturing a thin film vapor chamber, comprising the step of compressing the upper surface area of the upper plate corresponding to the interruption of the channel portion with a punch.
In paragraph 11 The step of welding the flat area so that the above chamber portion is sealed is, A method for manufacturing a thin film vapor chamber, comprising the step of performing laser welding in a direction across the interruption of the channel portion on the flat area.

Description

A component for manufacturing a thin film vapor chamber and a method for manufacturing a thin film vapor chamber using the same The present disclosure relates to a component for manufacturing a thin film vapor chamber and a method for manufacturing a thin film vapor chamber using the same. More specifically, it relates to one or more components for manufacturing a thin film vapor chamber having a structure capable of effectively filling and sealing a working fluid inside the chamber, and a method for manufacturing a thin film vapor chamber using the same. The following description merely provides background information related to the present embodiment and does not constitute prior art. With the advancement of technology, the capabilities of portable electronic devices such as smartphones and tablet PCs are becoming increasingly sophisticated. Generally, portable electronic devices integrate various components—including CPUs, RAM, batteries, display devices, and circuit boards—within a limited space; as the functionality of each component becomes more advanced, the amount of heat generated within the device also increases. In particular, due to the advancement of wireless communication networks and the development of artificial intelligence technology, the computational load performed by devices installed in portable electronic devices is increasing exponentially, and the amount of heat generated inside the device is also rising rapidly in proportion. Since heat generation within portable electronic devices causes various problems regarding device lifespan, performance, and user safety, heat dissipation elements such as vapor chambers are utilized to effectively release internal heat. A vapor chamber is configured to dissipate heat by causing a working fluid filled inside a sealed chamber to repeatedly evaporate, move, and condense in response to heat applied from a heat-generating component within the electronic device. Recently, various thin-film vapor chambers suitable for miniaturized portable electronic devices are being developed and applied. The manufacturing process for a typical vapor chamber involves creating a vacuum within the internal space, injecting the working fluid, and then sealing the chamber. Since thin-film vapor chambers are relatively small and thin, there are difficulties in effectively filling the internal space with the working fluid. For example, problems may arise, such as defects occurring during the vacuuming and fluid injection processes, including chamber deformation or breakage, or fluid leakage due to incomplete sealing. To address these issues, conventional thin-film vapor chambers fill the working fluid by connecting a separate injection tube to the injection port or forming additional reinforcing structures around the port. However, these conventional thin-film vapor chambers require additional processes for fabricating and connecting the injection tube or reinforcing structures, which increases the complexity, time, and cost of the manufacturing process. Furthermore, there is still a risk that defects in the injection tube or reinforcing structures themselves may result in inaccurate injection of the working fluid or imperfect sealing. Therefore, there is a need to develop a new thin-film vapor chamber capable of effectively filling the chamber with working fluid without the need for injection tubes or reinforcing structures. FIG. 1 is a perspective view of a member for manufacturing a steam chamber according to one embodiment of the present disclosure. FIG. 2 is an exploded perspective view of a component for manufacturing a steam chamber according to one embodiment of the present disclosure. FIG. 3 is a drawing for explaining the structure of the internal space of a member for manufacturing a steam chamber according to one embodiment of the present disclosure. FIG. 4 is a partial cutaway view of a member for manufacturing a vapor chamber to explain the internal structure of an operating fluid injection part according to one embodiment of the present disclosure. FIG. 5 is a flowchart showing each step of a method for manufacturing a thin film vapor chamber according to one embodiment of the present disclosure. FIG. 6 is a drawing for specifically explaining the process of manufacturing a thin film vapor chamber according to one embodiment of the present disclosure. FIG. 7 is a partial enlarged view of a component for manufacturing a vapor chamber to specifically explain the process of sealing the chamber part and separating the working fluid injection part during the process of manufacturing the thin film vapor chamber of FIG. 6. The advantages and features of the present invention and the methods for achieving them will become clear by referring to the embodiments described below in detail together with the accompanying drawings. However, embodiments of the technical concept of the present invention are not limited to the embodiments disclosed below but can be impleme