WO-2026095516-A1 - COMPONENT MOUNTING DEVICE AND COMPONENT MOUNTING METHOD

WO2026095516A1WO 2026095516 A1WO2026095516 A1WO 2026095516A1WO-2026095516-A1

Abstract

A component mounting device according to one embodiment of the present invention comprises: a first component supply part and a second component supply part, which are disposed in the front-rear direction; a first rail part and a second rail part which are disposed between the first component supply part and the second component supply part and which transfer a loaded PCB in the left-right direction; first and second component mounting parts for picking up components from each of the first component supply part and the second component supply part and mounting the components onto the PCB; and a rail shuttle part for transferring the PCB from the first rail part to the second rail part.

Inventors

KIM, TACK JONG
LEE, JE PIL

Assignees

한화세미텍 주식회사

Dates

Publication Date: 20260507
Application Date: 20251024
Priority Date: 20241101

Claims (12)

A first component supply unit and a second component supply unit arranged in the front-rear direction; A first rail section and a second rail section disposed between the first component supply section and the second component supply section, and transporting the mounted PCB in the left and right directions; A first and second component mounting unit that picks up components from the first component supply unit and the second component supply unit, respectively, and mounts the components on the PCB; and A component mounting device comprising a rail shuttle unit for transporting the PCB from the first rail unit to the second rail unit.
In Article 1, A component mounting device in which the rail length of the second rail section is variable.
In Article 1, The PCB being transported in the first rail section is transported to the rail shuttle section, and The 2-2 rail portion located in the variable area of the 2 rail portion is moved to the 2-1 rail portion not located in the variable area of the 2 rail portion, and the total length of the rail is reduced, and A component mounting device in which the rail shuttle carrying the above PCB moves to a variable area of the above second rail.
In Article 1, A first up-down rail section that is raised and lowered and connected to the first rail section when rising; and It includes a second up-down rail section that is raised and lowered and connects to the second rail section when rising, and When the first up-down rail section is lowered, the rail shuttle section is located on the upper side of the first up-down rail section, and A component mounting device in which, when the second up-down rail section is lowered, the rail shuttle section is located on the upper side of the second up-down rail section.
In Article 1, The above rail shuttle unit is, A first rail shuttle connected to the first rail section; and It includes a second rail shuttle connected to the second rail section, and When the first rail shuttle unit is connected to the second rail unit while carrying a PCB on which the first component is mounted, The above-mentioned second rail shuttle is a component mounting device connected to the first rail.
In Article 1, A first single rail connected to a rail that is relatively far from the second rail section among the two rails of the first rail section; and It includes a second single rail connected to a rail that is relatively far from the first rail section among the two rails of the second rail section, The above rail shuttle unit includes an inner rail unit and an outer rail unit, and The above PCB is the first single rail and the first outer rail portion of the rail shuttle portion or A component mounting device that is transported through the second single rail and the second outer rail section of the rail shuttle section.
A step of mounting a first component on a PCB transferred to the first rail section; A step in which a rail shuttle connected to the first rail section receives the PCB on which the first component is mounted from the first rail section, separates from the first rail section, and moves to the second rail section; A step in which the above rail shuttle part is connected to the above second rail part; A step in which the PCB mounted on the rail shuttle section is transferred to the second rail section; A step in which the PCB is placed on the second rail section, and the rail shuttle returns to a position where it is connected to the first rail section again; A step of mounting a second component on the PCB transferred to the second rail section; and A component mounting method comprising the step of transferring the PCB on which the first component and the second component are mounted to an exit.
In Article 7, The step of connecting the above rail shuttle part to the above second rail part is A step of moving a 2-2 rail portion located in the variable area of the 2nd rail portion to a 2-1 rail portion not located in the variable area; and A method for mounting a component, comprising the step of moving the rail shuttle portion to the variable area and connecting it to the second-1 rail portion.
In Article 7, After the step in which a rail shuttle connected to the first rail section receives the PCB on which the first component is mounted from the first rail section, and is separated from the first rail section and moved to the second rail section, The first up-down rail section further includes the step of rising and connecting to the first rail section, and Before the step in which the above rail shuttle part is connected to the first rail part, A component mounting method further comprising the step of lowering the second up-down rail portion to release the connection with the second rail portion.
In Article 7, The step of a rail shuttle connected to the first rail section receiving the PCB on which the first component is mounted from the first rail section, and separating from the first rail section and moving to the second rail section, A step in which a first rail shuttle separated from a first rail section is moved to a second rail section; and It includes the step of moving a second rail shuttle unit, separated from the second rail unit, to the first rail unit, and The step of the PCB being placed on the second rail section and the rail shuttle returning to a position connected to the first rail section again is A method for mounting a component, comprising the step of the first rail shuttle returning to a position connected to the first rail, and the second rail shuttle returning to a position connected to the second rail.
In Article 7, A first single rail connected to a rail that is relatively far from the second rail among the two rails of the first rail section; and It includes a second single rail connected to a rail that is relatively far from the first rail among the two rails of the second rail section, and The above rail shuttle unit includes first and second inner rail units disposed on the inside and first and second outer rail units disposed on the outside, and The step of connecting the above rail shuttle part to the above second rail part is The method includes the step of connecting the second outer rail portion of the rail shuttle portion to the second front rail portion of the second rail portion, and connecting the second single rail to the second rear rail portion of the second rail portion. The step of the rail shuttle returning to a position connected to the first rail section again is A method for mounting a component, comprising the step of connecting a first outer rail portion of the rail shuttle portion to a first rear rail portion of the first rail portion, and connecting a first single rail to a first front rail portion of the first rail portion.
In Article 7, It includes a second single rail connected to a rail that is relatively far from the first rail among the two rails of the second rail section, and The above rail shuttle unit includes a first inner rail unit positioned at the front and a second inner rail unit and a second outer rail unit positioned at the rear, and The step of connecting the above rail shuttle part to the above second rail part is The method includes the step of connecting the second outer rail portion of the rail shuttle portion to the second front rail portion of the second rail portion, and connecting the second single rail to the second rear rail portion of the second rail portion. The step of the rail shuttle returning to a position connected to the first rail section again is A method for mounting a component, comprising the step of connecting a first inner rail portion of the rail shuttle portion to a first front rail portion of the first rail portion, and connecting a second inner rail portion of the rail shuttle portion to a first rear rail portion of the first rail portion.

Description

Component mounting device and component mounting method Embodiments of the present invention relate to a component mounting device and a component mounting method. In the case of Surface Mounting Technology (SMT) equipment, components are supplied from a component supply device and mounted onto a PCB. In this first component supply method, component supply devices are positioned on the front and back sides according to component type, respectively. For PCBs supplied from the position corresponding to the front side, various types of components are supplied and mounted from the component supply devices positioned on the front side through the component transfer and mounting device positioned on the front side. Similarly, for PCBs supplied from the position corresponding to the back side, various types of components are supplied and mounted from the component supply devices positioned on the back side through the component transfer and mounting device positioned on the back side. In addition, in the second component supply method, a component transfer and mounting device positioned at the front can pick up a component from a component supply device positioned at the front and mount one type of component on both a PCB supplied at a position corresponding to the front and a PCB supplied at a position corresponding to the rear. Additionally, a component transfer and mounting device positioned at the rear can pick up a component from a component supply device positioned at the rear and mount another type of component on both a PCB supplied at a position corresponding to the rear and a PCB supplied at a position corresponding to the front. However, since the first component supply method requires the component supply device, nozzle, and nozzle supply device (ANC) to be configured in duplicate on the front and rear according to the type of component, it becomes difficult to achieve compactness of the component supply system. In the case of the second component supply method, compared to the first component supply method, a single component supply device can mount one type of component on both the front and back PCBs, thereby securing double the component mounting performance. Consequently, a greater number of component types can be mounted on the PCB. However, in the case of the second component feeding method, the component transfer distance during front-to-back operation of the component transfer and mounting device is longer than that of the first component feeding method, which may result in a decrease in PCB production speed. Additionally, in the case of the second component feeding method, if the component transfer and mounting device positioned at the rear is operating at the front, the device positioned at the front is forced to wait, which may result in a loss of working time. FIG. 1(a) is a block diagram of a component mounting device according to one embodiment of the present invention. FIG. 1(b) is a conceptual diagram of the main configuration of a component mounting device according to one embodiment of the present invention viewed from above. FIG. 2 is a flowchart of a component mounting device according to one embodiment of the present invention. FIGS. 3 to 8 are drawings showing the component mounting process of a component mounting device according to one embodiment of the present invention in sequence. FIG. 9 is a flowchart showing the main contents of the component mounting process according to FIG. 3 to FIG. 8. FIGS. 10 to 15 are drawings illustrating the component mounting process of a component mounting device according to another embodiment of the present invention in sequence. FIG. 16 is a flowchart showing the main contents of the component mounting process according to FIG. 10 to FIG. 15. FIGS. 17 to 21 are drawings showing the component mounting process of a component mounting device according to another embodiment of the present invention in sequence. FIG. 22 is a flowchart showing the main contents of the component mounting process according to FIG. 17 to FIG. 21. FIGS. 23 to 28 are drawings showing the component mounting process of a component mounting device according to another embodiment of the present invention in sequence. FIG. 29 is a flowchart showing the main contents of the component mounting process according to FIG. 23 to FIG. 28. FIGS. 30 and 31 are drawings illustrating a component mounting device and a component mounting process according to another embodiment of the present invention. The present invention is capable of various modifications and may have various embodiments; specific embodiments are illustrated in the drawings and described in detail in the description of the invention. However, this is not intended to limit the present invention to specific embodiments, and it should be understood that the invention includes all modifications, equivalents, and substitutions that fall within the spirit and scope of the invention. In describing the present invention, the