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WO-2026095614-A1 - GLASS SUBSTRATE SINGULATION PROCESS AND GLASS SUBSTRATE UNIT MANUFACTURED THEREBY

WO2026095614A1WO 2026095614 A1WO2026095614 A1WO 2026095614A1WO-2026095614-A1

Abstract

A glass substrate singulation process according to an embodiment of the present application comprises the steps of: forming a metal pattern on one surface or both surfaces of a glass substrate; forming an insulating layer on the one surface or both the surfaces of the glass substrate on which the metal pattern has been formed; removing the insulating layer formed on the metal pattern from the insulating layer; forming a protective layer on the insulating layer; removing the metal pattern; and forming a glass substrate unit by cutting the glass substrate along a position at which the metal pattern of the glass substrate has been removed.

Inventors

  • JUNG, DAE CHUL
  • KWON, OH TAK
  • RYU, Sanguk
  • YOO, Sangmoon
  • LEE, CHANG HEE
  • CHOI, A NAM

Assignees

  • 주식회사 엘지화학

Dates

Publication Date
20260507
Application Date
20251029
Priority Date
20241031

Claims (15)

  1. A step of forming a metal pattern on one or both sides of a glass substrate; A step of forming an insulating layer on one or both sides of a glass substrate on which the above metal pattern is formed; A step of removing the insulating layer formed on the metal pattern among the insulating layers; A step of forming a protective layer on the insulating layer; Step of removing the above metal pattern; and A glass substrate singulation process comprising the step of cutting the glass substrate along the location where the metal pattern of the glass substrate is removed to form a glass substrate unit.
  2. In claim 1, A glass substrate singulation process in which the metal pattern above is a Cu pattern.
  3. In claim 1, A glass substrate singulation process in which the insulating layer is ABF (Ajinomoto Build-up Film).
  4. In claim 1, The step of removing the insulating layer formed on the metal pattern among the insulating layers is, A glass substrate singulation process that is a step of exposing at least a portion of the metal pattern.
  5. In claim 1, A glass substrate singulation process in which the step of removing an insulating layer formed on a metal pattern among the insulating layers is a step of removing an insulating layer formed on a metal pattern using a CO2 laser or a UV laser.
  6. In claim 1, The above protective layer is formed using a positive photosensitive material or a negative photosensitive material in a glass substrate singulation process.
  7. In claim 1, The step of forming a protective layer on the insulating layer is, A glass substrate singulation process that does not form a protective layer on at least a portion of the metal pattern.
  8. In claim 1, A glass substrate singulation process in which the step of removing the metal pattern is a step of etching the metal pattern using a metal etching solution to expose the glass substrate.
  9. In claim 1, The step of forming a glass substrate unit by cutting the glass substrate along the location where the metal pattern of the glass substrate has been removed is: A step of irradiating a glass-modifying laser at a location where the metal pattern of the glass substrate has been removed; and A glass substrate singulation process comprising the step of etching the glass substrate to divide it into a plurality of glass substrate units.
  10. In claim 9, The above glass-modified laser is a Bessel beam in the glass substrate singulation process.
  11. In claim 9, The above A glass substrate singulation process in which the step of etching a glass substrate to divide it into a plurality of glass substrate units includes the step of etching the glass substrate using a glass etching solution at a vertical etching rate of 3 μm/min or more.
  12. In claim 1, A glass substrate singulation process further comprising the step of removing a protective layer from the above glass substrate unit.
  13. A glass substrate unit manufactured by a glass substrate singulation process according to any one of claims 1 to 12.
  14. First plane and second plane facing each other; A first inclined side connected to the first plane above; and A glass substrate unit including a second inclined side connected to the second plane, The first side and the second side meet roundly at the center of the thickness of the glass substrate unit, and A glass substrate unit having a surface roughness (Ra) of the first side of the above-mentioned first side of 0.1㎛ to 10㎛.
  15. In claim 14, The first side has a taper angle of 50° to 70°, A glass substrate unit in which the taper angle of the first side is the angle between a plane perpendicular to the first plane and the first side.

Description

Glass substrate singulation process and glass substrate unit manufactured therefrom The present application relates to a glass substrate singulation process and a glass substrate unit manufactured therefrom. The present application claims the benefit of the filing dates of Korean Patent Application No. 10-2024-0152434 filed with the Korean Intellectual Property Office on October 31, 2024, and Korean Patent Application No. 10-2025-0157570 filed with the Korean Intellectual Property Office on October 28, 2025, the entire contents of which are incorporated herein by reference. Glass substrates, which are gaining attention as next-generation packaging materials, offer superior warpage and CTE (coefficient of thermal expansion) compared to conventional organic substrates, enabling the implementation of large-area substrates and providing significant advantages for high-speed signaling and heat dissipation due to the increased number of I/O ports. However, in the case of glass substrates, when singulating into units after the lamination process is completed, if singulating is performed using mechanical sewing, which is used in conventional printed circuit boards, a problem arises where the glass breaks. To address this, processes utilizing lasers to directly cut glass substrates are being researched; however, there is a problem with microcracks occurring on the cut surface of the glass substrate, and this issue has not yet been resolved. Therefore, research is needed on a technology that can chemically singulate a glass substrate without causing thermal or material shock. [Prior Art] (Patent Document 1) Korean Patent Publication No. 10-2011-0060622 Figure 1 is a figure showing a conventional glass substrate singulation process. Figures 2 to 5 illustrate problems with conventional singulation processes. Figures 6a and 6b are figures illustrating a glass substrate singulation process according to the present invention. FIG. 7 is a diagram showing the arrangement of a metal pattern according to the present invention. FIG. 8 is a perspective view of a glass substrate unit according to the present invention. FIG. 9 is a cross-sectional view of the edge portion of a unit of a glass substrate according to the present invention. FIGS. 10 to 14 show cross-sectional views after singulation of a glass substrate according to an embodiment of the present invention. [Explanation of the symbol] 10: Glass substrate 11: Metal pattern 20: Insulating layer 21: Laser for cutting insulation layers 30: Protection layer 31: Laser for internal deformation of glass substrates 100: Glass substrate unit The present application will be described in more detail below. When a part in this application is described as "comprising" a certain component, this means that, unless specifically stated otherwise, it does not exclude other components but may include additional components. In this application, "A to B" means "A or more and B or less". In this application, when referring to the "surface" or "image" of an object, it may mean all parts of the object that come into contact with the outside. In this application, a first direction (DR1), a second direction (DR2), and a third direction (DR3) are defined in the attached drawings. The first direction (DR1) and the second direction (DR2) may exist on the same plane and be perpendicular to each other. The first direction (DR1) and the third direction (DR3) may exist on another same plane and be perpendicular to each other. The second direction (DR2) and the third direction (DR3) may exist on yet another same plane and be perpendicular to each other. The first direction (DR1) may mean the horizontal direction in the drawings, and the second direction (DR2) may mean the vertical direction in the drawings. The third direction (DR3) may mean the upper and lower directions in the drawings, i.e., the thickness direction. The first to third directions (DR1, DR2, DR3) are relative to what is indicated in the drawings. In this application, unless otherwise specified, "direction" may refer to both directions facing each other that extend along that direction. Additionally, if it is necessary to distinguish between the two "directions" extending to both sides, one side shall be referred to as "direction side one" and the other side as "direction other side," respectively. The direction in which the arrow indicating the direction points may be the first side, and the opposite direction may be the other side. In the following description, for convenience of explanation, when describing the surfaces of each member, the surface facing one side of the third direction (DR3) may be referred to as the upper surface, and the surface opposite to said surface may be referred to as the lower surface or the lower surface. However, this is not limited thereto, and said surface and said other surface of said member may be referred to as the front surface and the back surface, or as the first surface or the second surface, r