WO-2026096377-A1 - IDENTIFICATION MARKERS FOR LIGHT-EMITTING DIODE PACKAGES AND RELATED IDENTIFICATION METHODS

Abstract

Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly identification markers (12) for LED packages (10, 40,...) and related methods are disclosed. Identification markers (12) may include materials incorporated within LED packages (10, 40,...) that are transparent in a visible spectrum but detectable when illuminated with light (34) outside the visible spectrum. When radiated with light (34) outside the visible spectrum, identification markers (12) may provide light (36) in the visible spectrum. Alternatively, identification markers (12) may provide light outside the visible spectrum that is detectable with equipment capable of detecting non-visible light. Identification markers (12) are generally configured to not be readily visible under inspection as a way to make LED packages (10, 40,...) more difficult for copying in counterfeit products.

Inventors

• SUICH, DAVID
• BLAKELY, Colin
• CHECK, Michael
• SOKOL, Joseph, G.
• PERTUIT, ANDRE

Assignees

• CREELED, INC.

Dates

Publication Date

20260507

Application Date

20251027

Priority Date

20241031

Claims (20)

1. 1 . A light-emitting diode (LED) package comprising: at least one LED chip; a support structure comprising electrical connections electrically coupled to the at least one LED chip; and an identification marker on the support structure, the identification marker configured to be transparent to light in a first wavelength range from 400 nanometers (nm) to 700 nm.
2. 2. The LED package of claim 1 , wherein the identification marker is configured to be detectable under light in a second wavelength range that is outside the first wavelength range.
3. 3. The LED package of claim 2, wherein the identification marker is configured to convert light in the second wavelength range to visible light in the first wavelength range.
4. 4. The LED package of claim 2, wherein the identification marker is configured to absorb light in the second wavelength range and generate light in the second wavelength range that is detectable with a detection device capable of detecting light in the second wavelength range.
5. 5. The LED package of claim 2, wherein the second wavelength range is from 100 nm to less than 400 nm or from above 700 nm to 2000 nm.
6. 6. The LED package of claim 1 , wherein the support structure comprises a submount on which the at least one LED chip is mounted, and the identification marker is on the submount and laterally spaced from the at least one LED chip.
7. 7. The LED package of claim 6, further comprising an encapsulant on the submount, wherein the encapsulant forms a lens over the at least one LED chip and the identification marker is outside a boundary of the lens.
8. 8. The LED package of claim 7, wherein the encapsulant forms an extension that laterally extends from the boundary of the lens to a peripheral edge of the submount, and the identification marker is covered by the extension.
9. 9. The LED package of claim 1 , further comprising a lumiphoric material on the at least one LED chip, the lumiphoric material configured to convert at least a portion of light from the at least one LED chip to another wavelength that is in the first wavelength range.
10. 10. The LED package of claim 9, wherein the lumiphoric material is further arranged to cover the identification marker on the support structure.
11. 1 1 . The LED package of claim 9, wherein the lumiphoric material is between the identification marker and the support structure.
12. 12. The LED package of claim 9, wherein the identification marker comprises a distribution of particles within the lumiphoric material.
13. 13. The LED package of claim 1 , wherein the identification marker is on the at least one LED chip.
14. 14. The LED package of claim 1 , wherein the identification marker is between the at least one LED chip and the support structure.
15. 15. The LED package of claim 1 , further comprising a first package mounting pad and a second package mounting pad on a side of the support structure opposite the at least one LED chip, wherein the identification marker is between the first package mounting pad and the second package mounting pad.
16. 16. The LED package of claim 1 , wherein the identification marker forms at least one of alphanumeric characters, a bar code, or a quick-response code.
17. 17. The LED package of claim 1 , wherein the identification marker comprises a unique material such that the remainder of the LED package is devoid of the unique material.
18. 18. A method of identification for a light-emitting device, the method comprising: providing a light-emitting diode (LED) package comprising at least one LED chip configured to emit light in a first wavelength range from 400 nanometers (nm) to 700 nm and an identification marker configured to be transparent to light in the first wavelength range; and detecting the identification marker.
19. 19. The method of claim 18, wherein detecting the identification marker comprises radiating the LED package with a light source, the light source providing light in a second wavelength range from 100 nm to less than 400 nm or from above 700 nm to 2000 nm.
20. 20. The method of claim 18, wherein detecting the identification marker comprises destructive characterization of the LED package.

Description

IDENTIFICATION MARKERS FOR LIGHT-EMITTING DIODES AND RELATED METHODS Field of the Disclosure [0001] The present disclosure relates to solid-state lighting devices including light-emitting diodes (LEDs) and more particularly to identification markers for LED packages. Background [0002] Solid-state lighting devices such as light-emitting diodes (LEDs) are increasingly used in both consumer and commercial applications. Advancements in LED technology have resulted in highly efficient and mechanically robust light sources with a long service life. Accordingly, modern LEDs have enabled a variety of new applications. [0003] LEDs are solid-state devices that convert electrical energy to light and generally include one or more active layers of semiconductor material (or an active region) arranged between oppositely doped n-type and p-type layers. When a bias is applied across the doped layers, holes and electrons are injected into the one or more active layers where they recombine to generate emissions such as visible light or ultraviolet emissions. An LED chip typically includes an active region that may be fabricated, for example, from gallium nitride, gallium phosphide, aluminum nitride, gallium arsenide-based materials, and/or from organic semiconductor materials. LED packages have been developed that can provide mechanical support, electrical connections, and encapsulation for LED chips with suitable emission efficiencies. [0004] The art continues to seek improved LEDs and solid-state lighting devices having desirable operating characteristics capable of overcoming challenges associated with conventional devices. [0005] The present disclosure relates to solid-state lighting devices including light-emitting diodes (LEDs) and more particularly to identification markers for LED packages and related methods. Identification markers may include materials incorporated within LED packages that are transparent in a visible spectrum but detectable when illuminated with light outside the visible spectrum. When radiated with light outside the visible spectrum, identification markers may provide light in the visible spectrum. Alternatively, identification markers may provide light outside the visible spectrum that is detectable with equipment capable of detecting nonvisible light. Identification markers are generally configured to not be readily visible under inspection as a way to make LED packages more difficult for copying in counterfeit products. [0006] In one aspect, an LED package comprises: at least one LED chip; a support structure comprising electrical connections electrically coupled to the at least one LED chip; and an identification marker on the support structure, the identification marker configured to be transparent to light in a first wavelength range from 400 nanometers (nm) to 700 nm. In certain embodiments, the identification marker is configured to be detectable under light in a second wavelength range that is outside the first wavelength range. In certain embodiments, the identification marker is configured to convert light in the second wavelength range to visible light in the first wavelength range. In certain embodiments, the identification marker is configured to absorb light in the second wavelength range and generate light in the second wavelength range that is detectable with a detection device capable of detecting light in the second wavelength range. In certain embodiments, the second wavelength range is from 100 nm to less than 400 nm or from above 700 nm to 2000 nm. [0007] In certain embodiments, the support structure comprises a submount on which the at least one LED chip is mounted, and the identification marker is on the submount and laterally spaced from the at least one LED chip. The LED package may further comprise an encapsulant on the submount, wherein the encapsulant forms a lens over the at least one LED chip and the identification marker is outside a boundary of the lens. In certain embodiments, the encapsulant forms an extension that laterally extends from the boundary of the lens to a peripheral edge of the submount, and the identification marker is covered by the extension. [0008] The LED package may further comprise a lumiphoric material on the at least one LED chip, the lumiphoric material configured to convert at least a portion of light from the at least one LED chip to another wavelength that is in the first wavelength range. In certain embodiments, the lumiphoric material is further arranged to cover the identification marker on the support structure. In certain embodiments, the lumiphoric material is between the identification marker and the support structure. In certain embodiments, the identification marker comprises a distribution of particles within the lumiphoric material. [0009] In certain embodiments, the identification marker is on the at least one LED chip. In certain embodiments, the identification marker is between the at least one LED chip and the support