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WO-2026096453-A1 - ELECTRONIC DEVICE COOLING WITH INTEGRATED MAGNETICS

WO2026096453A1WO 2026096453 A1WO2026096453 A1WO 2026096453A1WO-2026096453-A1

Abstract

An electronic device (100) includes a semiconductor die (110) having a first side attached to a substrate (107), a first plate (130) having a first portion (131) attached to a second side of the semiconductor die (110) and a second portion (132, 133) extending from the first portion (131) away from the semiconductor die (110), a metal clip (140) having a second clip portion (142) coupled to a first conductive feature (121) of the substrate (107), a third clip portion (143) coupled to a second conductive feature (121) of the substrate (107), and a first clip portion (141) above and spaced apart from the first portion (131) of the first plate (130) that extends between the second and third clip portions (142, 143), a magnetic molding compound package structure (108) enclosing the metal clip (140), the semiconductor die (110), and the first portion (131) of the first plate (130), and a second plate (150) exposed outside the package structure (108) and thermally coupled to the second portion (132, 133) of the first plate (130).

Inventors

  • MOLINA, John, Carlo
  • COLTE, JASON
  • LOPEZ, OSVALDO

Assignees

  • TEXAS INSTRUMENTS INCORPORATED

Dates

Publication Date
20260507
Application Date
20251028
Priority Date
20241031

Claims (20)

  1. 1. An electronic device, comprising: a semiconductor die having opposite first and second sides, the first side attached to a substrate; a first plate having first and second portions, the first portion attached to the second side of the semiconductor die and the second portion extending from the first portion away from the semiconductor die; a metal clip having a first clip portion, a second clip portion, and a third clip portion, the second clip portion coupled to a first conductive feature of the substrate, the third clip portion coupled to a second conductive feature of the substrate, the first clip portion above and spaced apart from the first portion of the first plate and extending between the second and third clip portions; a package structure including magnetic molding compound that encloses the metal clip, the semiconductor die, and the first portion of the first plate; and a second plate at least partially exposed outside the package structure and thermally coupled to the second portion of the first plate.
  2. 2. The electronic device of claim 1, further comprising solder that couples the second plate to the second portion of the first plate.
  3. 3. The electronic device of claim 2, wherein the second plate is coupled to the second portion of the first plate in a recess that extends into a side of the package structure.
  4. 4. The electronic device of claim 1, wherein the first and second plates are metal.
  5. 5. The electronic device of claim 1, wherein the metal clip forms a portion of a turn of an inductor or transformer.
  6. 6. The electronic device of claim 5, wherein the metal clip is a first metal clip, the electronic device further comprising a second metal clip spaced apart from the first metal clip and enclosed by the package structure, the second metal clip having a first clip portion, a second clip portion, and a third clip portion, the second clip portion of the second metal clip coupled to a third conductive feature of the substrate, the third clip portion of the second metal clip coupled to a fourth conductive feature of the substrate, the first clip portion of the second metal clip above and spaced apart from the first portion of the first plate and extending between the second and third clip portions of the second metal clip.
  7. 7. The electronic device of claim 1, wherein the substrate includes conductive leads configured to be soldered to a circuit board.
  8. 8. The electronic device of claim 1, wherein: the first plate has a third portion spaced apart from the second portion and extending from the first portion away from the semiconductor die; and the second plate is thermally coupled to the third portion of the first plate.
  9. 9. The electronic device of claim 1, wherein the first portion of the first plate is electrically coupled to the second side of the semiconductor die.
  10. 10. The electronic device of claim 1, wherein: the semiconductor die is a first semiconductor die; the electronic device further comprising a second semiconductor die having opposite first and second sides, the first side of the second semiconductor die attached to the substrate; and the first portion of the first plate is attached to the second side of the second semiconductor die.
  11. 11. A system, comprising: a circuit board having a conductive trace; and an electronic device, comprising: a substrate having opposite first and second sides, a lead along the first side of the substrate, and first and second conductive features along the second side of the substrate, the lead electrically coupled to the conductive trace of the circuit board; a semiconductor die having opposite first and second sides, the first side attached to the second side of the substrate; a first plate having first and second portions, the first portion attached to the second side of the semiconductor die and the second portion extending from the first portion away from the semiconductor die; a metal clip having a first clip portion, a second clip portion, and a third clip portion, the second clip portion coupled to a first conductive feature of the substrate, the third clip portion coupled to a second conductive feature of the substrate, the first clip portion above and spaced apart from the first portion of the first plate and extending between the second and third clip portions; a package structure including magnetic molding compound that encloses the metal clip, the semiconductor die, and the first portion of the first plate; and a second plate at least partially exposed outside the package structure and thermally coupled to the second portion of the first plate.
  12. 12. A method of fabricating an electronic device, the method comprising: attaching a first side of a semiconductor die to a substrate; attaching a first portion of a first plate to an opposite second side of the semiconductor die with a second portion of the first plate extending from the first portion away from the semiconductor die; attaching second and third clip portions of a metal clip to respective conductive features of the substrate with a first clip portion of the metal clip above and spaced apart from the first portion of the first plate and the first clip portion extending between the second and third clip portions; forming a package structure including magnetic molding compound that encloses the metal clip, the semiconductor die, and the first portion of the first plate; removing a portion of the package structure to expose the second portion of the first plate; and thermally coupling a second plate to an exposed surface of the second portion of the first plate with a portion of the second plate at least partially exposed outside the package structure.
  13. 13. The method of claim 12, wherein attaching the semiconductor die to the substrate includes flip chip soldering conductive terminals of the semiconductor die to conductive features of the substrate.
  14. 14. The method of claim 12, wherein: the semiconductor die is a first semiconductor die; the method further comprises attaching a first side of a second semiconductor die to the substrate; and attaching the first portion of the first plate to an opposite second side of the second semiconductor die.
  15. 15. The method of claim 12, wherein: the metal clip is a first metal clip; the method further comprises attaching second and third clip portions of a second metal clip to respective conductive features of the substrate with a first clip portion of the second metal clip above and spaced apart from the first portion of the first plate, the first clip portion of the second metal clip extending between the second and third clip portions of the second metal clip, and with the second metal clip spaced apart from the first metal clip; and forming the package structure encloses the second metal clip in the magnetic molding compound.
  16. 16. The method of claim 12, wherein removing the portion of the package structure to expose the second portion of the first plate includes performing a cutting process (1200) to form a recess that extends into a side of the package structure and exposes the second portion of the first plate.
  17. 17. The method of claim 16, wherein thermally coupling the second plate to the exposed surface of the second portion of the first plate includes soldering the second plate to the exposed surface of the second portion of the first plate in the recess.
  18. 18. The method of claim 17, wherein soldering the second plate to the exposed surface of the second portion of the first plate includes: forming solder in the recess; attaching the second plate to the package structure with a portion of the second plate engaging the solder in the recess; and reflowing the solder.
  19. 19. The method of claim 12, wherein removing the portion of the package structure to expose the second portion of the first plate includes performing a laser ablation process to form a recess that extends into a side of the package structure and exposes the second portion of the first plate.
  20. 20. The method of claim 12, wherein attaching the first portion of the first plate to the second side of the semiconductor die includes electrically coupling the first portion of the first plate to the second side of the semiconductor die.

Description

ELECTRONIC DEVICE COOLING WITH INTEGRATED MAGNETICS BACKGROUND [0001] Power modules and communications devices with integrated magnetics, such as transformer windings and/or inductor coils are used for a variety of applications. Inductors and transformer components often require good thermal performance which typically depends on module thickness. However, compact system designs call for higher levels of integration along with small package size, which can challenge thermal device performance. SUMMARY [0002] In one aspect, an electronic device includes a semiconductor die with a first side attached to a substrate, a first plate with a first portion attached to the semiconductor die and a second portion extending from the first portion away from the semiconductor die. A metal clip having first, second and third portions is spaced apart from the first plate, with the second and third clip portions coupled respective conductive feature of the substrate, and the first clip portion extend between the second and third clip portions above the first portion of the first plate. A package structure including magnetic molding compound encloses the metal clip, the semiconductor die, and the first portion of the first plate, and a second plate at least partially exposed outside the package structure is thermally coupled to the second portion of the first plate. [0003] In another aspect, a system includes a circuit board having a conductive trace and an electronic device with a lead electrically coupled to the conductive trace of the circuit board. The electronic device includes a substrate having opposite first and second sides, the lead along the first side of the substrate, and conductive features along the second side of the substrate. A semiconductor die has a first side attached to the second side of the substrate, a first plate with a first portion attached to the semiconductor die, and a second portion extending from the first portion away from the semiconductor die. A metal clip having first, second and third portions is spaced apart from the first plate, with the second and third clip portions coupled respective conductive feature of the substrate, and the first clip portion extend between the second and third clip portions above the first portion of the first plate. A package structure including magnetic molding compound encloses the metal clip, the semiconductor die, and the first portion of the first plate, and a second plate at least partially exposed outside the package structure is thermally coupled to the second portion of the first plate. [0004] In a further aspect, a method of fabricating an electronic device includes attaching a first side of a semiconductor die to a substrate, attaching a first portion of a first plate to an opposite second side of the semiconductor die with a second portion of the first plate extending from the first portion away from the semiconductor die, attaching second and third clip portions of a metal clip to respective conductive features of the substrate with a first clip portion of the metal clip above and spaced apart from the first portion of the first plate and the first clip portion extending between the second and third clip portions, forming a package structure including magnetic molding compound that encloses the metal clip, the semiconductor die, and the first portion of the first plate, removing a portion of the package structure to expose the second portion of the first plate, and thermally coupling a second plate to an exposed surface of the second portion of the first plate with a portion of the second plate at least partially exposed outside the package structure. BRIEF DESCRIPTION OF THE DRAWINGS [0005] FIG. 1 is a sectional side elevation view of an electronic device taken along line 1-1 in FIGS. 1A-1D. [0006] FIG. 1A is a sectional top view of the electronic device taken along line 1A-1A in FIG. 1. [0007] FIG. IB is a sectional top view of the electronic device taken along line 1B-1B in FIG. 1. [0008] FIG. 1C is a sectional top view of the electronic device taken along line 1C-1C in FIG. 1. [0009] FIG. ID is a top perspective view of the electronic device of FIGS. 1-1C. [0010] FIG. IE is a sectional side elevation view of the electronic device taken along line 1E- 1E in FIGS. 1A-1C. [0011] FIG. 2 is a flow diagram of a method of fabricating an electronic device. [0012] FIGS. 3-16 are partial side elevation and top views of the electronic device of FIGS. 1- 1E undergoing fabrication processing according to an implementation of the method of FIG. 2. DETAILED DESCRIPTION OF EXAMPLE EMBODIMENTS [0013] In the drawings, like reference numerals refer to like elements throughout, and the various features are not necessarily drawn to scale. Also, the term "couple" or "couples" includes indirect or direct electrical or mechanical connection or combinations thereof. For example, if a first device couples to or is coupled with a second device, that connection may b